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NVH640S75L4SPC

Onsemi

NVH640S75L4SPC by Onsemi

NVH640S75L4SPC by Onsemi is an N-CHANNEL IGBT with 3 BANKS, SERIES CONNECTED configuration. It has 6 elements, each with a built-in diode and thermistor. Ideal for POWER CONTROL applications, it offers a max VCEsat of 1.64V and can handle up to 680W power dissipation at a max operating temperature of 175 °C.

Median Price

$588.300

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Mouser Electronics

USA . 4 parts In-Stock

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$588.300

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Digiode

USA . 1,550 parts In-Stock

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Vyrian

USA . 6,778 parts In-Stock

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Corphita

USA . 1,432 parts In-Stock

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$514.332

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Corohmni

South Africa . 179 parts In-Stock

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$571.480

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TANS Electronics

Latvia . 7,969 parts In-Stock

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Kulean Microsystems

USA . 5,098 parts In-Stock

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Problanco Electronics

Mexico . 3,530 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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SupplyDigital Components

Austria . 472 parts In-Stock

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Overview

Unleash the power of innovation with the NVH640S75L4SPC by Onsemi! This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, backed by Onsemi's reputation as a trusted manufacturer in the industry. Ideal for power control applications, this N-CHANNEL transistor features 3 banks, series connected configuration with built-in diode and thermistor for optimal performance. With a maximum operating temperature of 175 °C and a maximum collector-emitter voltage of 750 V, this product delivers superior power dissipation and efficiency. Elevate your projects with the NVH640S75L4SPC and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This complex configuration allows for efficient power control and built-in protection features (diodes and thermistors), enhancing the overall performance and reliability of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for handling high power levels with precision and efficiency.

Maximum VCEsat: 1.64 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter terminals when conducting, resulting in lower power losses and improved energy efficiency.

Package Shape: RECTANGULAR

Rectangular packages offer good thermal dissipation and mechanical stability, ensuring reliable operation even under high power conditions.

Nominal Turn Off Time (toff): 956 ns

The fast turn-off time enables precise control over the power output, reducing switching losses and improving overall efficiency of the circuit.

Maximum Power Dissipation (Abs): 680 W

With a high maximum power dissipation rating, this IGBT can handle high power levels without overheating, making it suitable for demanding power control applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide easy installation and secure mounting, ensuring reliable operation in various industrial environments.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to withstand elevated temperatures, making it suitable for high-power applications where thermal management is crucial.

Maximum Collector-Emitter Voltage: 750 V

The high maximum collector-emitter voltage rating ensures that the IGBT can safely handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high switching speeds, low ON resistance, and high breakdown voltage, making them ideal for power control applications.

Maximum Gate-Emitter Voltage: 20 V

The low maximum gate-emitter voltage rating ensures proper gate control and protection against overvoltage conditions, enhancing the overall reliability of the IGBT.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this IGBT to operate reliably in cold environments, making it suitable for a wide range of industrial applications.

Terminal Position: UPPER

The upper terminal position facilitates easier connections and wiring, improving overall usability and installation convenience.

Case Connection: ISOLATED

Isolated case connection provides enhanced safety and protection against electrical shock hazards, making the IGBT suitable for safety-critical applications.

Nominal Turn On Time (ton): 359 ns

The fast turn-on time enables rapid switching and precise control over the power output, improving the overall efficiency and performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NVH640S75L4SPC attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

750 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X33

No. of Elements:

6

No. of Terminals:

33

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

956 ns

Nominal Turn On Time (ton):

359 ns

Maximum VCEsat:

1.64 V

Trade Compliance

NVH640S75L4SPC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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