Loading...

NVH660S75L4SPFB

Onsemi

NVH660S75L4SPFB by Onsemi

NVH660S75L4SPFB by Onsemi is an N-CHANNEL IGBT with 3 BANKS, SERIES CONNECTED configuration. It has 6 elements, each with a built-in diode and thermistor. With a max VCEsat of 1.44V, it's ideal for POWER CONTROL applications requiring high power dissipation up to 733W at temperatures ranging from -40 °C to 175°C.

Median Price

$580.737

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

$464.590

100+ parts

$436.710

1k+ parts

$408.840

10k+ parts

-

7

$464.590

$436.710

$408.840

-

Verical

USA . 7 parts In-Stock

1+ parts

$580.737

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$580.737

-

-

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$634.670

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$634.670

-

-

-

DigiKey

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,834 parts In-Stock

1+ parts

$333.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,834

$333.108

-

-

-

Vyrian

USA . 3,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

-

-

-

-

Flip Electronics

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 267 parts In-Stock

1+ parts

$315.576

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$315.576

-

-

-

Corohmni

South Africa . 97 parts In-Stock

1+ parts

$350.640

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$350.640

-

-

-

Kulean Microsystems

USA . 4,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,454

-

-

-

-

SupplyDigital Components

Austria . 4,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,439

-

-

-

-

Problanco Electronics

Mexico . 4,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,072

-

-

-

-

UHIMA Technologies

Türkiye . 985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

985

-

-

-

-

TANS Electronics

Latvia . 795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

795

-

-

-

-

Overview

Experience the cutting-edge technology and superior quality of the NVH660S75L4SPFB by Onsemi, a leading manufacturer in the industry. As part of the Insulated Gate Bipolar Transistors (IGBT) category, this product offers exceptional power control capabilities with its N-CHANNEL polarity and 3 banks, series connected configuration. With 6 elements and a maximum operating temperature of 175 °C, this transistor is designed for high-performance applications. Trust in the reliability and efficiency of Onsemi's NVH660S75L4SPFB to elevate your projects and deliver outstanding results.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them ideal for power control applications.

Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for increased power handling capacity and better thermal management, ensuring reliable performance in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and precise control of power systems.

Maximum VCEsat: 1.44 V

The low VCEsat value indicates minimal power loss during operation, leading to higher efficiency and lower heat generation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation, making it convenient for integration into power control systems.

No. of Elements: 6

Having 6 elements increases the power handling capacity of the IGBT, making it suitable for high-power applications.

Nominal Turn Off Time (toff): 1601 ns

The relatively fast turn-off time ensures quick response and precise control in power switching applications.

Maximum Power Dissipation (Abs): 733 W

With a high maximum power dissipation rating, this IGBT can handle high power levels without overheating or performance degradation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation, ensuring reliable operation in demanding environments.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for operation in a wide range of environments, increasing the versatility of this IGBT.

Maximum Collector-Emitter Voltage: 750 V

The high maximum collector-emitter voltage rating enables this IGBT to handle high voltage levels, making it suitable for a variety of power control applications.

Transistor Element Material: SILICON

Silicon is a common material used in IGBTs due to its high thermal conductivity and reliability, ensuring long-term performance and durability.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures safe and reliable operation of the IGBT, protecting it from overvoltage conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments, increasing the flexibility and reliability of this IGBT.

Terminal Position: UPPER

The upper terminal position simplifies wiring and connection, making it easier to integrate this IGBT into power control systems.

Case Connection: ISOLATED

The isolated case connection enhances safety and reliability by minimizing the risk of short circuits and electrical interference.

Nominal Turn On Time (ton): 422 ns

The fast turn-on time ensures quick response and precise control in power switching applications, improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NVH660S75L4SPFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

750 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X33

No. of Elements:

6

No. of Terminals:

33

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1601 ns

Nominal Turn On Time (ton):

422 ns

Maximum VCEsat:

1.44 V

Trade Compliance

NVH660S75L4SPFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5