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NVH640S75L4SPB

Onsemi

NVH640S75L4SPB by Onsemi

NVH640S75L4SPB by Onsemi is an N-CHANNEL IGBT with 6 elements in 3 banks, series connected. It has a max VCEsat of 1.64V and a power dissipation of 680W. Ideal for power control applications, it operates b/w -40 to 175 °C with a collector-emitter voltage of 750V.

Median Price

$510.570

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 3 parts In-Stock

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$510.570

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$298.160

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Digiode

USA . 2,461 parts In-Stock

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$542.906

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Vyrian

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Flip Electronics

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Corphita

USA . 2,484 parts In-Stock

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$514.332

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Corohmni

South Africa . 245 parts In-Stock

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$571.480

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 5,431 parts In-Stock

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Problanco Electronics

Mexico . 4,365 parts In-Stock

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TANS Electronics

Latvia . 1,672 parts In-Stock

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UHIMA Technologies

Türkiye . 978 parts In-Stock

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Kulean Microsystems

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Overview

Unleash the power of control with the NVH640S75L4SPB by Onsemi! Crafted with precision and expertise, this Insulated Gate Bipolar Transistor offers superior performance in a variety of applications. With its innovative design and advanced features, this product ensures optimal power control and efficiency. Experience the reliability and quality that only Onsemi can deliver, and elevate your projects to new heights with the NVH640S75L4SPB.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making them a preferable choice for power control applications.

Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for efficient power distribution and control, as well as built-in protection features like diodes and thermistors.

Maximum VCEsat: 1.64 V

Low VCEsat means lower power dissipation and improved efficiency in power control applications.

Maximum Power Dissipation (Abs): 680 W

High power dissipation rating ensures that the IGBT can handle high power loads without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the IGBT to function reliably in various industrial environments.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high switching speeds and low on-state voltage drops, making them ideal for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NVH640S75L4SPB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

750 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X33

JESD-609 Code:

e3

No. of Elements:

6

No. of Terminals:

33

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

956 ns

Nominal Turn On Time (ton):

359 ns

Maximum VCEsat:

1.64 V

Trade Compliance

NVH640S75L4SPB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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