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NVH660S75L4SPFC

Onsemi

NVH660S75L4SPFC by Onsemi

NVH660S75L4SPFC by Onsemi is an N-CHANNEL IGBT with 3 BANKS, SERIES CONNECTED configuration. It has a Max VCEsat of 1.44V and Nominal Turn Off Time of 1601ns, making it ideal for POWER CONTROL applications. With a Max Power Dissipation of 733W and Max Collector-Emitter Voltage of 750V, this RECTANGULAR package transistor operates b/w -40 to 175 °C for efficient power management.

Median Price

$634.670

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Mouser Electronics

USA . 4 parts In-Stock

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DigiKey

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Digiode

USA . 1,044 parts In-Stock

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Vyrian

USA . 6,397 parts In-Stock

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Flip Electronics

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Corphita

USA . 367 parts In-Stock

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$538.713

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Corohmni

South Africa . 56 parts In-Stock

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$598.570

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Kulean Microsystems

USA . 8,297 parts In-Stock

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Problanco Electronics

Mexico . 3,079 parts In-Stock

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SupplyDigital Components

Austria . 2,485 parts In-Stock

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TANS Electronics

Latvia . 2,304 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Overview

Experience the power of innovation with the NVH660S75L4SPFC by Onsemi! As a leader in the industry, Onsemi consistently delivers top-quality products like this Insulated Gate Bipolar Transistor that offers unparalleled performance and reliability. Perfect for power control applications, this N-CHANNEL transistor boasts 3 banks, series connected configuration, ensuring optimal functionality. With built-in diode and thermistor, this product provides maximum power dissipation of 733 W, making it a standout choice for any project. Upgrade your systems with the NVH660S75L4SPFC and enjoy superior efficiency and advanced technology at your fingertips.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making this product suitable for power control applications.

Maximum VCEsat: 1.44 V

The low maximum collector-emitter saturation voltage ensures minimal power loss during operation, increasing the overall efficiency of the device.

Nominal Turn Off Time (toff): 1601 ns

The relatively fast turn off time allows for quick switching and precise power control, making this IGBT ideal for applications requiring precise timing.

Maximum Power Dissipation (Abs): 733 W

With a high maximum power dissipation rating, this IGBT can handle high power loads without overheating or failing, ensuring reliable performance in demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation even in harsh environments or under heavy load conditions, making this IGBT suitable for a wide range of applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NVH660S75L4SPFC attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

750 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X33

No. of Elements:

6

No. of Terminals:

33

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1601 ns

Nominal Turn On Time (ton):

422 ns

Maximum VCEsat:

1.44 V

Trade Compliance

NVH660S75L4SPFC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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