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NV25010MUW3VTBG

Onsemi

NV25010MUW3VTBG by Onsemi

NV25010MUW3VTBG by Onsemi is an AEC-Q100 EEPROM with 128x8 organization, SPI serial bus type, and 10 MHz clock frequency. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and 1000000 write/erase cycles endurance.

Median Price

$0.560

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

$0.295

3,000

$0.560

-

-

$0.295

Flip Electronics (Authorized)

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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72,000

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-

-

-

DigiKey

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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36,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 56 parts In-Stock

1+ parts

$0.475

100+ parts

-

1k+ parts

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10k+ parts

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56

$0.475

-

-

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Vyrian

USA . 1,299 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,299

$0.500

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Flip Electronics

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

72,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,294 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

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10k+ parts

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2,294

$0.450

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-

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Corohmni

South Africa . 170 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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10k+ parts

-

170

$0.500

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-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$2.867

100+ parts

$2.609

1k+ parts

$2.351

10k+ parts

-

50

$2.867

$2.609

$2.351

-

Kulean Microsystems

USA . 5,374 parts In-Stock

1+ parts

-

100+ parts

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5,374

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Problanco Electronics

Mexico . 4,910 parts In-Stock

1+ parts

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4,910

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SupplyDigital Components

Austria . 3,445 parts In-Stock

1+ parts

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100+ parts

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3,445

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TANS Electronics

Latvia . 1,045 parts In-Stock

1+ parts

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100+ parts

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1,045

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UHIMA Technologies

Türkiye . 432 parts In-Stock

1+ parts

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100+ parts

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432

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Overview

Unlock the power of reliable data storage with the NV25010MUW3VTBG by Onsemi. Crafted with precision and expertise, this EEPROM offers unparalleled quality and performance. Ideal for automotive applications, this small yet powerful device is designed to meet the highest industry standards. With a wide range of features including hardware/software write protection and 1,000,000 write/erase cycles, this EEPROM ensures data integrity and longevity. Trust Onsemi to deliver cutting-edge technology that adds value to your products and enhances customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during manufacturing.

Screening Level: AEC-Q100

Ensures high reliability and quality, especially important for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common voltage level, making it compatible with many systems.

Memory Density: 1024 bit

Offers sufficient storage capacity for data, suitable for various applications.

Endurance: 1000000 Write/Erase Cycles

Can withstand a high number of write and erase cycles, ensuring long-term reliability.

Serial Bus Type: SPI

Uses a popular and widely supported serial bus interface, enhancing compatibility with other devices.

Technical Specifications

EEPROM NV25010MUW3VTBG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 1.8 TO 5.5V SUPPLY VOLTAGE AT 5 MHZ FREQUENCY

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

NV25010MUW3VTBG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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