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NV25010DWHFT3G

Onsemi

NV25010DWHFT3G by Onsemi

EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Write Cycle Time (tWC): 4 ms;

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,118 parts In-Stock

1+ parts

$0.430

100+ parts

$0.378

1k+ parts

$0.290

10k+ parts

$0.248

5,118

$0.430

$0.378

$0.290

$0.248

DigiKey

USA . 2,985 parts In-Stock

1+ parts

$0.430

100+ parts

$0.378

1k+ parts

$0.350

10k+ parts

$0.259

2,985

$0.430

$0.378

$0.350

$0.259

Flip Electronics (Authorized)

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,000

-

-

-

-

Rochester

USA . 38,713 parts In-Stock

1+ parts

-

100+ parts

$0.285

1k+ parts

$0.236

10k+ parts

$0.211

38,713

-

$0.285

$0.236

$0.211

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.263

33,000

-

-

-

$0.263

Chip1Stop

Japan . 2,940 parts In-Stock

1+ parts

-

100+ parts

$4.730

1k+ parts

$4.080

10k+ parts

-

2,940

-

$4.730

$4.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,270 parts In-Stock

1+ parts

$0.221

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$0.221

-

-

-

Vyrian

USA . 1,114 parts In-Stock

1+ parts

$0.233

100+ parts

-

1k+ parts

-

10k+ parts

-

1,114

$0.233

-

-

-

Flip Electronics

USA . 147,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147,000

-

-

-

-

Rapid Electronics

USA . 2,940 parts In-Stock

1+ parts

-

100+ parts

$0.430

1k+ parts

-

10k+ parts

-

2,940

-

$0.430

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,469 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

$0.210

-

-

-

Corohmni

South Africa . 421 parts In-Stock

1+ parts

$0.233

100+ parts

-

1k+ parts

-

10k+ parts

-

421

$0.233

-

-

-

Component Stockers USA

USA . 45,959 parts In-Stock

1+ parts

$0.370

100+ parts

$0.350

1k+ parts

$0.310

10k+ parts

$0.310

45,959

$0.370

$0.350

$0.310

$0.310

Vigor

Singapore . 264 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$0.410

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$3.146

100+ parts

$2.863

1k+ parts

$2.580

10k+ parts

-

3,000

$3.146

$2.863

$2.580

-

Microchip USA

USA . 5,282 parts In-Stock

1+ parts

$3.368

100+ parts

-

1k+ parts

-

10k+ parts

-

5,282

$3.368

-

-

-

iodParts Technologies Inc.

India . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,000

-

-

-

-

Kepictronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Kulean Microsystems

USA . 6,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,795

-

-

-

-

SupplyDigital Components

Austria . 5,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,827

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

TANS Electronics

Latvia . 1,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

-

-

-

-

Problanco Electronics

Mexico . 134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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134

-

-

-

-

UHIMA Technologies

Türkiye . 79 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

79

-

-

-

-

Technical Specifications

EEPROM NV25010DWHFT3G attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

4 ms

Trade Compliance

NV25010DWHFT3G Memory ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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