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NTTFS5C478NLTAG

Onsemi

NTTFS5C478NLTAG by Onsemi

NTTFS5C478NLTAG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 104A IDM, and 0.025 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for power management applications requiring high current handling capabilities.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,500 parts In-Stock

1+ parts

$2.500

100+ parts

$0.906

1k+ parts

$0.806

10k+ parts

-

1,500

$2.500

$0.906

$0.806

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Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

$0.887

10k+ parts

-

1,500

-

$1.160

$0.887

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,184 parts In-Stock

1+ parts

$2.432

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2,184

$2.432

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Vyrian

USA . 7,298 parts In-Stock

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7,298

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Distributors (Availability)

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Corphita

USA . 2,288 parts In-Stock

1+ parts

$2.304

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2,288

$2.304

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Corohmni

South Africa . 277 parts In-Stock

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$2.650

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277

$2.650

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Microchip USA

USA . 4,296 parts In-Stock

1+ parts

$4.995

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4,296

$4.995

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AZTECH Wire

Italy . 891 parts In-Stock

1+ parts

$8.230

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891

$8.230

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SupplyDigital Components

Austria . 3,017 parts In-Stock

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3,017

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Kulean Microsystems

USA . 2,832 parts In-Stock

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2,832

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TANS Electronics

Latvia . 1,879 parts In-Stock

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1,879

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Problanco Electronics

Mexico . 1,853 parts In-Stock

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UHIMA Technologies

Türkiye . 435 parts In-Stock

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435

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Overview

Elevate your power management solutions with the NTTFS5C478NLTAG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled performance and reliability. Ideal for a wide range of applications, this N-CHANNEL FET with a built-in diode is designed to optimize efficiency and enhance operational capabilities. Experience the seamless integration of cutting-edge technology and superior quality in a compact, user-friendly package. Unlock new possibilities with Onsemi's innovative transistor technology, delivering powerful results with every use. Partner with us today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand high temperatures, making the FET suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher conductivity compared to P-channel FETs, resulting in better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse voltage protection, making the FET more reliable in different circuit configurations.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance helps in reducing power losses and improving efficiency in power applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can handle demanding thermal conditions without sacrificing performance.

Maximum Power Dissipation (Abs): 20 W

With a high power dissipation rating, this FET can handle higher power applications effectively.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5C478NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

43 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

26 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

104 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5C478NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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