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NTMS10P02R2

Onsemi

NTMS10P02R2 by Onsemi

NTMS10P02R2 by Onsemi is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 4.5A Drain Current, and 0.014 ohm On Resistance. With a max operating temperature of 150 °C, this MOSFET is ideal for high-power switching circuits in various electronic devices.

Median Price

$0.779

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 349 parts In-Stock

1+ parts

-

100+ parts

$0.779

1k+ parts

$0.647

10k+ parts

$0.577

349

-

$0.779

$0.647

$0.577

Distributors (In-Stock)

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Digiode

USA . 2,367 parts In-Stock

1+ parts

$0.607

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2,367

$0.607

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Chip Stock

USA . 51,000 parts In-Stock

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51,000

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Vyrian

USA . 12,989 parts In-Stock

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12,989

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Kruse Electronics AG

Switzerland . 10,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,268 parts In-Stock

1+ parts

$0.575

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-

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2,268

$0.575

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Corohmni

South Africa . 79 parts In-Stock

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$0.590

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79

$0.590

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AZTECH Wire

Italy . 102 parts In-Stock

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$15.990

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102

$15.990

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SupplyDigital Components

Austria . 7,326 parts In-Stock

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7,326

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Kulean Microsystems

USA . 5,852 parts In-Stock

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5,852

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RC Electronics

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 2,988 parts In-Stock

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Kepictronics

USA . 2,265 parts In-Stock

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2,265

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A-Z Elektronik GmbH

Germany . 1,583 parts In-Stock

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1,583

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UHIMA Technologies

Türkiye . 610 parts In-Stock

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610

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TANS Electronics

Latvia . 349 parts In-Stock

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349

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Overview

Discover the cutting-edge NTMS10P02R2 by Onsemi, a high-quality P-Channel Small Signal Field Effect Transistor perfect for switching applications. With a compact design and built-in diode, this transistor offers unmatched efficiency and performance. Ideal for a wide range of electronic devices, this product delivers value and reliability to customers seeking top-notch components. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the NTMS10P02R2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance and high current-carrying capabilities, making this transistor suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards.

Minimum DS Breakdown Voltage: 20 V

Suitable for applications requiring a minimum breakdown voltage of 20V.

Maximum Drain Current (Abs) (ID): 4.5 A

Capable of handling high drain currents, making it ideal for power applications.

Maximum Power Dissipation (Abs): 0.4 W

Efficient power dissipation rating ensures reliable operation without overheating.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance ensures minimal power loss and efficient switching.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without degradation in performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMS10P02R2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

8.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1010 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMS10P02R2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-642-5539, 5961016425539

NIIN

016425539

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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