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NTMFS4H01NFT3G

Onsemi

NTMFS4H01NFT3G by Onsemi

NTMFS4H01NFT3G by Onsemi is a N-CHANNEL FET with 334A ID, 125W power dissipation, and 150 °C max operating temp. Ideal for high-power applications requiring efficient switching and control in surface-mount configurations.

Median Price

$3.052

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$2.880

1k+ parts

$2.580

10k+ parts

$2.420

5,000

-

$2.880

$2.580

$2.420

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.225

10k+ parts

$3.025

5,000

-

-

$3.225

$3.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 491 parts In-Stock

1+ parts

$3.030

100+ parts

-

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491

$3.030

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Vyrian

USA . 6,793 parts In-Stock

1+ parts

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6,793

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Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,999 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

-

10k+ parts

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1,999

$2.871

-

-

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Corohmni

South Africa . 150 parts In-Stock

1+ parts

$3.190

100+ parts

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150

$3.190

-

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AZTECH Wire

Italy . 92 parts In-Stock

1+ parts

$12.260

100+ parts

-

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92

$12.260

-

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Component Stockers USA

USA . 635 parts In-Stock

1+ parts

$99.990

100+ parts

-

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635

$99.990

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Perfect Parts

USA . 33,600 parts In-Stock

1+ parts

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33,600

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TANS Electronics

Latvia . 5,897 parts In-Stock

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5,897

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Problanco Electronics

Mexico . 4,610 parts In-Stock

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4,610

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Kulean Microsystems

USA . 3,666 parts In-Stock

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3,666

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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SupplyDigital Components

Austria . 2,727 parts In-Stock

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2,727

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UHIMA Technologies

Türkiye . 638 parts In-Stock

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638

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Overview

Unleash the power of innovation with the NTMFS4H01NFT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors. With applications spanning from automotive to industrial, this N-CHANNEL FET offers unparalleled performance and efficiency. Say goodbye to overheating and hello to seamless operation with a maximum power dissipation of 125W and a maximum drain current of 334A. Trust Onsemi to provide the technology you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - N-channel FETs typically have better performance and lower on-state resistance compared to P-channel FETs, making this product suitable for high-power applications.

Configuration

SINGLE - Single configuration makes the installation and use of this FET simpler and more straightforward.

Surface Mount

YES - Surface mount capability allows for easy integration onto circuit boards, saving space and enabling compact designs.

Maximum Drain Current (Abs) (ID)

334 A - High maximum drain current rating allows for handling of large currents, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs)

125 W - High power dissipation capability ensures the FET can handle significant power without overheating, improving reliability.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - MOSFET technology offers high switching speeds and low on-state resistance, enhancing the performance of this FET.

Maximum Operating Temperature

150 °C - High maximum operating temperature allows for reliable operation in a wide range of environments without risk of overheating.

Terminal Finish

MATTE TIN - Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection in various conditions.

Maximum Time At Peak Reflow Temperature (s)

30 - Short time at peak reflow temperature reduces the risk of damage to the FET during assembly, ensuring durability.

Peak Reflow Temperature °C

260 - High peak reflow temperature capability allows for proper soldering of the FET onto circuit boards, ensuring secure connections.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4H01NFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

334 A

Maximum Drain Current (ID):

334 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4H01NFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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