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NTMFS4841NHT3G

Onsemi

NTMFS4841NHT3G by Onsemi

NTMFS4841NHT3G by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 177A, EAS of 98mJ, and ID of 59A. With 0.0116 ohm RDS(on), this MOSFET operates in ENHANCEMENT MODE at up to 150 °C.

Median Price

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In-Stock Inventory

1k+

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Vyrian

USA . 5,967 parts In-Stock

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Digiode

USA . 1,778 parts In-Stock

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AZTECH Wire

Italy . 186 parts In-Stock

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$17.610

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Component Stockers USA

USA . 758 parts In-Stock

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Kulean Microsystems

USA . 7,986 parts In-Stock

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TANS Electronics

Latvia . 3,686 parts In-Stock

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SupplyDigital Components

Austria . 3,185 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,036 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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Corohmni

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Overview

Unleash the power of innovation with the NTMFS4841NHT3G by Onsemi! This top-of-the-line Power Field Effect Transistor (FET) offers unparalleled quality and reliability, thanks to Onsemi's renowned manufacturing expertise. Ideal for switching applications, this N-CHANNEL transistor boasts a single configuration with a built-in diode, providing seamless operation and enhanced performance. With a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 30V, this transistor delivers exceptional efficiency and durability. Elevate your projects with the NTMFS4841NHT3G and experience the next level of power management technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and can withstand high temperatures, making this product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse current flow, enhancing the reliability and efficiency of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast response times and efficient power management.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, providing precise switching capabilities for various electronic devices.

Maximum Pulsed Drain Current (IDM): 177 A

With a high pulsed drain current rating, this FET can handle heavy loads and transient spikes without risking damage.

Maximum Power Dissipation (Abs): 41.7 W

The high power dissipation rating ensures that the FET can operate efficiently without overheating, enhancing its overall performance.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can perform reliably in various environments without the risk of thermal shutdown.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4841NHT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

98 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

59 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.0116 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

177 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4841NHT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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