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NTMFS4833NT1G

Onsemi

NTMFS4833NT1G by Onsemi

NTMFS4833NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 288A IDM, 612.5mJ EAS, and 0.003ohm RDS(ON). Operating at 150°C max temp, it has a power dissipation of 125W in a small outline package.

Median Price

$0.722

Lifecycle Status

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19

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1k+

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RS (Exports)

UK . 1 parts In-Stock

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Newark

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Farnell

UK . 2,127 parts In-Stock

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Rochester

USA . 16,500 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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Arrow

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Vyrian

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Digiode

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Chip Stock

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Flip Electronics

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Bristol Electronics

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Component Sense

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Sensible Micro Corp

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Semi Source

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ComSIT Distribution GmbH

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Microfarads

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Prism Electronics

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Ampacity Inc.

Singapore . 3,621 parts In-Stock

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Corohmni

South Africa . 310 parts In-Stock

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Corphita

USA . 1,623 parts In-Stock

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Component Stockers USA

USA . 4,473 parts In-Stock

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AZTECH Wire

Italy . 1,077 parts In-Stock

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Kulean Microsystems

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Overview

Discover the power of the Onsemi NTMFS4833NT1G, a high-quality Power FET that sets the standard for efficiency and reliability. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications, delivering unmatched performance. Whether you're looking to enhance your system's capabilities or improve energy efficiency, this product offers incredible value and benefits. Trust in Onsemi's reputation for excellence and maximize your project's potential with the NTMFS4833NT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the transistor from environmental factors, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance and efficiency compared to P-channel transistors, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against reverse current flow and ensures the safe operation of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency, making it suitable for power control circuits.

Surface Mount: YES

Being surface mountable, this transistor is easy to integrate into compact electronic devices, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltages without breakdown, ensuring reliable performance in various voltage levels.

Maximum Pulsed Drain Current (IDM): 288 A

The high pulsed drain current rating allows the transistor to handle sudden surges in current without damage, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 612.5 mJ

The high avalanche energy rating indicates the ability of the transistor to withstand high energy spikes, ensuring reliable operation in harsh electrical environments.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this transistor can handle significant amounts of power without overheating, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.003 ohm

The low drain-source on resistance results in minimal power loss and high efficiency in power switching applications, making this transistor a cost-effective choice.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4833NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

612.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

191 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

288 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4833NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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