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NTJD4401NT4G

Onsemi

NTJD4401NT4G by Onsemi

NTJD4401NT4G by Onsemi is a N-CHANNEL FET with 2 elements, diode, and resistor for SWITCHING applications. It has a max drain current of 0.63A, on-resistance of 0.375 ohm, and breakdown voltage of 20V. This small outline transistor operates in enhancement mode at up to 150 °C.

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SupplyDigital Components

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TANS Electronics

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Overview

Unlock the power of innovation with the NTJD4401NT4G by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor (FET) is a game-changer in the world of switching applications. Featuring a unique configuration with built-in diode and resistor, this N-CHANNEL transistor offers unmatched performance and reliability. Say goodbye to limitations and embrace endless possibilities with this cutting-edge technology. Elevate your projects to new heights with the NTJD4401NT4G and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the transistor, enhancing its performance in switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Offers added functionality with built-in diode and resistor, making it versatile for different circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in this type of operation.

Surface Mount: YES

Easily mountable on circuit boards, saving space and providing convenient installation in electronic devices.

Maximum Drain Current (Abs) (ID): 0.63 A

Capable of handling high current loads, making it suitable for various applications with demanding power requirements.

Maximum Power Dissipation (Abs): 0.55 W

Efficiently dissipates heat generated during operation, ensuring stable performance even under high power conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for applications where temperature variations occur.

Maximum Drain-Source On Resistance: 0.375 ohm

Low on-resistance leads to minimal power loss and high efficiency, making it suitable for power-sensitive applications.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance minimizes signal distortion and loss, making it ideal for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4401NT4G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.63 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4401NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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