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BSS138NH6433

Infineon Technologies

BSS138NH6433 by Infineon Technologies

Infineon's BSS138NH6433 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.23A Drain Current, and 3.5 ohm On Resistance. Ideal for small signal applications in automotive electronics due to AEC-Q101 and IEC-61249-2-21 compliance.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 107,983 parts In-Stock

1+ parts

$0.360

100+ parts

$0.156

1k+ parts

$0.086

10k+ parts

$0.057

107,983

$0.360

$0.156

$0.086

$0.057

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Chip1Stop

Japan . 5,664 parts In-Stock

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$0.060

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$0.046

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$0.045

5,664

-

$0.060

$0.046

$0.045

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.095

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100

$0.095

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Digiode

USA . 490 parts In-Stock

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$0.180

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$0.180

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Vyrian

USA . 75,436 parts In-Stock

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Rutronik

Germany . 70,000 parts In-Stock

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$0.044

Rebound Electronics

UK . 69,394 parts In-Stock

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Cyclops Electronics Ltd

UK . 20,000 parts In-Stock

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Flip Electronics

USA . 12,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 9,972 parts In-Stock

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VNN

France . 6,666 parts In-Stock

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Kiltronic GmbH

Germany . 1,100 parts In-Stock

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Bristol Electronics

USA . 400 parts In-Stock

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Atlantic Semiconductor

USA . 400 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Argo Parts USA

USA . 3,865 parts In-Stock

1+ parts

$0.087

100+ parts

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$0.084

3,865

$0.087

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$0.084

Continental Prestige Electronics

USA . 3,089 parts In-Stock

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$0.087

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$0.085

3,089

$0.087

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$0.085

Netroflash

USA . 500 parts In-Stock

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$0.095

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500

$0.095

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Ampacity Inc.

Singapore . 75,536 parts In-Stock

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$0.162

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Decca Corp

Germany . 75,213 parts In-Stock

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$0.162

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$0.159

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$0.157

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75,213

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Semicontronic

India . 75,037 parts In-Stock

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$0.162

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$0.158

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$0.157

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Corphita

USA . 587 parts In-Stock

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Modulus Dynamics

Lithuania . 2,593 parts In-Stock

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$0.471

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$0.452

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$0.433

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Aztec Data Supply Inc.

USA . 171 parts In-Stock

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$1.380

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Corohmni

South Africa . 34 parts In-Stock

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Perfect Parts

USA . 24,093 parts In-Stock

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RC Electronics

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 9,440 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 4,986 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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$10.785

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$10.785

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$10.785

$10.785

Overview

Discover the high-quality BSS138NH6433 by Infineon Technologies, a top-tier manufacturer of Small Signal Field Effect Transistors. With its N-CHANNEL polarity and single configuration with a built-in diode, this FET offers unparalleled performance in various applications. From power management to signal amplification, this product ensures reliable operation with a 60V minimum DS breakdown voltage. Experience the value and benefits of Infineon's cutting-edge technology with the BSS138NH6433, delivering efficiency and precision for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing voltage spikes and protects the circuit from damage.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation in various voltage applications.

Surface Mount: YES

Surface mount technology allows for easy and space-efficient installation on PCBs.

Maximum Drain Current (Abs) (ID): 0.23 A

The high maximum drain current allows for handling moderate power loads efficiently.

Maximum Power Dissipation Ambient: 0.36 W

The low power dissipation helps in keeping the device cool and prolonging its lifespan.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures stable performance under varying conditions.

Maximum Drain-Source On Resistance: 3.5 ohm

The low on-resistance results in lower power loss and better efficiency in the circuit.

Reference Standard: AEC-Q101; IEC-61249-2-21

Compliance with industry standards ensures quality and reliability of the product.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS138NH6433 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.23 A

Maximum Drain Current (ID):

.23 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3.8 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.36 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101; IEC-61249-2-21

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

BSS138NH6433 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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