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NTD6415ANLT4G

Onsemi

NTD6415ANLT4G by Onsemi

NTD6415ANLT4G by Onsemi is an N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 80A IDM, 79mJ EAS, and 0.056 ohm RDS(on). Operating from -55 to 175 °C, this MOSFET has a Drain terminal connection and is Surface Mountable.

Median Price

$1.840

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 2,849 parts In-Stock

1+ parts

$2.370

100+ parts

$1.550

1k+ parts

$1.360

10k+ parts

$1.340

2,849

$2.370

$1.550

$1.360

$1.340

Newark

USA . 2,837 parts In-Stock

1+ parts

$2.410

100+ parts

$1.420

1k+ parts

$1.050

10k+ parts

-

2,837

$2.410

$1.420

$1.050

-

DigiKey

USA . 4,441 parts In-Stock

1+ parts

$2.750

100+ parts

$1.221

1k+ parts

$0.995

10k+ parts

$0.813

4,441

$2.750

$1.221

$0.995

$0.813

Mouser Electronics

USA . 1,291 parts In-Stock

1+ parts

$2.750

100+ parts

$1.230

1k+ parts

$0.975

10k+ parts

$0.929

1,291

$2.750

$1.230

$0.975

$0.929

Avnet

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.849

7,500

-

-

-

$0.849

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.830

2,500

-

-

-

$0.830

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.830

2,500

-

-

-

$0.830

Farnell

UK . 1,476 parts In-Stock

1+ parts

-

100+ parts

$1.310

1k+ parts

$0.957

10k+ parts

$0.878

1,476

-

$1.310

$0.957

$0.878

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$1.020

100+ parts

-

1k+ parts

-

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54

$1.020

-

-

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Digiode

USA . 1,051 parts In-Stock

1+ parts

$1.748

100+ parts

-

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-

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1,051

$1.748

-

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-

Chip Stock

USA . 23,500 parts In-Stock

1+ parts

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23,500

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 2,020 parts In-Stock

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2,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,998 parts In-Stock

1+ parts

$0.710

100+ parts

$0.692

1k+ parts

$0.689

10k+ parts

-

1,998

$0.710

$0.692

$0.689

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Ampacity Inc.

Singapore . 1,940 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

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1,940

$0.710

-

-

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Corohmni

South Africa . 447 parts In-Stock

1+ parts

$0.830

100+ parts

-

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447

$0.830

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Aztec Data Supply Inc.

USA . 294 parts In-Stock

1+ parts

$0.900

100+ parts

-

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294

$0.900

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Continental Prestige Electronics

USA . 6,996 parts In-Stock

1+ parts

$0.977

100+ parts

-

1k+ parts

-

10k+ parts

$0.958

6,996

$0.977

-

-

$0.958

Argo Parts USA

USA . 752 parts In-Stock

1+ parts

$0.977

100+ parts

-

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752

$0.977

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Corphita

USA . 1,642 parts In-Stock

1+ parts

$1.656

100+ parts

-

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1,642

$1.656

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Microchip USA

USA . 2,693 parts In-Stock

1+ parts

$6.046

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2,693

$6.046

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Perfect Parts

USA . 28,068 parts In-Stock

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28,068

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Problanco Electronics

Mexico . 7,284 parts In-Stock

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Lixinc

USA . 6,509 parts In-Stock

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Kulean Microsystems

USA . 6,134 parts In-Stock

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TANS Electronics

Latvia . 5,626 parts In-Stock

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5,626

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Infinite Electronics LLP (Excess)

. 5,138 parts In-Stock

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5,138

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SupplyDigital Components

Austria . 4,917 parts In-Stock

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4,917

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Formix International (Excess)

India . 2,630 parts In-Stock

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2,630

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A-Z Elektronik GmbH

Germany . 2,252 parts In-Stock

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2,252

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.000

1k+ parts

$0.969

10k+ parts

$0.949

1,000

-

$1.000

$0.969

$0.949

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

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900

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UHIMA Technologies

Türkiye . 451 parts In-Stock

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451

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Overview

Discover the power of the NTD6415ANLT4G by Onsemi, a top-quality Power Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor with built-in diode is perfect for switching applications. With a maximum pulsing drain current of 80A and an avalanche energy rating of 79mJ, this transistor delivers outstanding results. Experience the benefits of enhanced mode operation, small outline package style, and matte tin terminal finish. Trust Onsemi for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher conductivity compared to P-channel FETs, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse current flow, enhancing the overall robustness of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient on/off performance, making it suitable for controlling current flow in electronic circuits.

Surface Mount: YES

Being surface mountable makes the FET easy to integrate into PCB designs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltages without experiencing damage, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy placement on PCBs, making it an ideal choice for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage applied to the gate for conduction, offering better control over the switching operation and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 80 A

The high pulsed drain current rating of 80A allows the FET to handle short-duration high-current spikes, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 79 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy transients, ensuring reliable performance in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 23 A

With a maximum drain current of 23A, this FET can handle moderate current loads, making it suitable for a variety of power management applications.

No. of Terminals: 2

Having only 2 terminals simplifies the FET's connection to the circuit, reducing the chances of wiring errors and improving reliability.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation rating of 83W allows the FET to handle high-power applications without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and makes the FET suitable for compact designs with tight layout constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making the FET suitable for a wide range of applications requiring fast switching speeds.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments, ensuring reliable performance in various operating conditions.

Transistor Element Material: SILICON

Silicon is a widely used material for transistor elements due to its high conductivity and thermal stability, ensuring efficient and reliable operation of the FET.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the FET to work reliably in cold environments, making it suitable for a wide range of temperature conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability and corrosion resistance, ensuring reliable connections in the circuit.

Maximum Drain-Source On Resistance: 0.056 ohm

The low drain-source on-resistance of 0.056 ohm minimizes power losses and heat generation, making the FET efficient for power management applications.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit layout and connection options, enhancing the FET's versatility in different applications.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and layout, providing easy access for connecting the drain terminal to external components.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds reduces the risk of thermal damage during soldering processes, ensuring the FET's reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections during assembly processes, maintaining the FET's performance.

Maximum Feedback Capacitance (Crss): 70 pF

The low feedback capacitance of 70 pF reduces the risk of parasitic oscillations and improves high-frequency performance, making the FET suitable for fast-switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD6415ANLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

70 pF

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD6415ANLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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