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NTD60N02RT4G

Onsemi

NTD60N02RT4G by Onsemi

NTD60N02RT4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 25V DS Breakdown Voltage, 32A Drain Current, and 0.0105 ohm Drain-Source Resistance. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 48W, making it ideal for high-performance electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Bristol Electronics

USA . 30,553 parts In-Stock

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Semi Source

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Vyrian

USA . 4,781 parts In-Stock

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Prism Electronics

USA . 4,386 parts In-Stock

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NexGen Digital

USA . 1,653 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,093 parts In-Stock

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Digiode

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675

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Velocity Electronics

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299

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A&K Electronics

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200

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AZTECH Wire

Italy . 758 parts In-Stock

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$17.160

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 3,581 parts In-Stock

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SupplyDigital Components

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Assy Fe

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A-Z Elektronik GmbH

Germany . 1,830 parts In-Stock

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Problanco Electronics

Mexico . 1,642 parts In-Stock

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TANS Electronics

Latvia . 992 parts In-Stock

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Kulean Microsystems

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Futuretech Components

Singapore . 510 parts In-Stock

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UHIMA Technologies

Türkiye . 490 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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Corphita

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Overview

Enhance your power management solutions with the NTD60N02RT4G by Onsemi, a high-quality Power FET perfect for switching applications. Manufactured by industry leader Onsemi, this N-channel transistor offers unparalleled performance and reliability. With a built-in diode, small outline package, and low on-resistance, this transistor maximizes efficiency while minimizing heat dissipation. Ideal for a wide range of applications, this powerful component ensures optimal performance in any project. Upgrade your power systems with the NTD60N02RT4G and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient current conduction and control in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with integrated diode for reverse current protection.

Transistor Application: SWITCHING

Designed for fast switching applications, making it suitable for a wide range of electronic devices.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort.

Minimum DS Breakdown Voltage: 25 V

Provides a high level of voltage tolerance for reliable operation in various power circuits.

Terminal Form: GULL WING

Enables easy soldering and connection to PCBs, improving overall assembly efficiency.

Operating Mode: ENHANCEMENT MODE

Allows for control over the conductivity of the transistor, enhancing its performance in switching applications.

Avalanche Energy Rating (EAS): 60 mJ

Capable of withstanding high energy spikes, ensuring protection against transient voltage surges.

Maximum Drain Current (Abs) (ID): 32 A

High current handling capacity for demanding applications.

Maximum Power Dissipation (Abs): 48 W

Efficient heat dissipation capability, enabling continuous operation at high power levels.

Package Style (Meter): SMALL OUTLINE

Compact form factor for space-saving installations in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high-speed switching performance and low power consumption for energy-efficient operation.

Maximum Operating Temperature: 150 °C

Wide operating temperature range for use in diverse environmental conditions.

Transistor Element Material: SILICON

Provides reliable and consistent performance over a long lifespan.

Terminal Finish: TIN

Corrosion-resistant finish for enhanced durability and longevity.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low on-resistance for efficient power conduction and minimal power loss.

Terminal Position: SINGLE

Simplified terminal arrangement for easy connection and integration into circuits.

Case Connection: DRAIN

Clear indication of the drain terminal for easy installation and circuit design.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature reflow processes during PCB assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTD60N02RT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD60N02RT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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