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NTD600N80S3Z

Onsemi

NTD600N80S3Z by Onsemi

NTD600N80S3Z by Onsemi is a Power FET with 800V DS Breakdown Voltage, 21A IDM, and 0.6 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 60W. This N-channel transistor has a small outline package style and can withstand temperatures from -55 to 150°C.

Median Price

$1.835

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 27 parts In-Stock

1+ parts

$1.008

100+ parts

$0.974

1k+ parts

-

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27

$1.008

$0.974

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Chip1Stop

Japan . 27 parts In-Stock

1+ parts

$1.650

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27

$1.650

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Farnell

UK . 1,437 parts In-Stock

1+ parts

$2.400

100+ parts

$1.180

1k+ parts

$0.967

10k+ parts

-

1,437

$2.400

$1.180

$0.967

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DigiKey

USA . 1,845 parts In-Stock

1+ parts

$3.080

100+ parts

$1.384

1k+ parts

$1.163

10k+ parts

$0.950

1,845

$3.080

$1.384

$1.163

$0.950

Mouser Electronics

USA . 1,672 parts In-Stock

1+ parts

$3.080

100+ parts

$1.390

1k+ parts

$1.140

10k+ parts

$1.090

1,672

$3.080

$1.390

$1.140

$1.090

Newark

USA . 1,417 parts In-Stock

1+ parts

$3.170

100+ parts

$1.420

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-

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1,417

$3.170

$1.420

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RS (Exports)

UK . 2,255 parts In-Stock

1+ parts

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$1.134

2,255

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$1.134

Element14

Singapore . 1,437 parts In-Stock

1+ parts

-

100+ parts

$2.020

1k+ parts

$1.660

10k+ parts

-

1,437

-

$2.020

$1.660

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Verical

USA . 1,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.337

10k+ parts

$1.193

1,360

-

-

$1.337

$1.193

Rochester

USA . 1,360 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.070

10k+ parts

$0.955

1,360

-

$1.290

$1.070

$0.955

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 212 parts In-Stock

1+ parts

$0.958

100+ parts

-

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212

$0.958

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Vyrian

USA . 2,159 parts In-Stock

1+ parts

$0.974

100+ parts

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2,159

$0.974

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Cyclops Electronics Ltd

UK . 263 parts In-Stock

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263

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Distributors (Availability)

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Corphita

USA . 1,003 parts In-Stock

1+ parts

$0.907

100+ parts

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1,003

$0.907

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$0.974

100+ parts

-

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368

$0.974

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

$1.960

100+ parts

$1.430

1k+ parts

$0.966

10k+ parts

-

5,000

$1.960

$1.430

$0.966

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Microchip USA

USA . 6,770 parts In-Stock

1+ parts

$7.067

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6,770

$7.067

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QUARKTWIN TECHNOLOGY LTD

USA . 25,042 parts In-Stock

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Perfect Parts

USA . 6,485 parts In-Stock

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6,485

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TANS Electronics

Latvia . 5,207 parts In-Stock

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SupplyDigital Components

Austria . 1,536 parts In-Stock

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1,536

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Problanco Electronics

Mexico . 1,447 parts In-Stock

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GreenTree Electronics

Israel . 1,345 parts In-Stock

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Kulean Microsystems

USA . 67 parts In-Stock

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Overview

Discover the power of the NTD600N80S3Z by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unmatched efficiency and reliability. The robust design and advanced technology of Onsemi ensure superior performance, making it the perfect choice for various electronic projects. Experience the benefits of enhanced mode operation, high breakdown voltage, and low on-resistance. Upgrade your devices with the NTD600N80S3Z and unleash their full potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and operation in a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with a built-in diode for protection and convenience.

Transistor Application: SWITCHING

Optimized for fast switching applications with high efficiency.

Surface Mount: YES

Easy to install and ideal for compact electronic designs.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage for reliable performance in high voltage applications.

Package Shape: RECTANGULAR

Space-efficient design for easy integration into circuit layouts.

Terminal Form: GULL WING

Allows for easy soldering and strong mechanical connection.

Operating Mode: ENHANCEMENT MODE

Efficient operation with low power consumption.

Maximum Pulsed Drain Current (IDM): 21 A

Capable of handling high current pulses for demanding applications.

Avalanche Energy Rating (EAS): 24 mJ

Resistant to voltage spikes and surges.

No. of Terminals: 2

Simplified connection and usage in circuits.

Maximum Power Dissipation (Abs): 60 W

Can handle high power dissipation for continuous operation.

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

High-performance technology for reliable operation.

Maximum Operating Temperature: 150 °C

Suitable for a wide range of temperature conditions.

Transistor Element Material: SILICON

Durable and efficient material for transistor operation.

Minimum Operating Temperature: -55 °C

Operates reliably in low temperature environments.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-lasting connection.

Maximum Drain Current (ID): 8 A

Capable of handling high continuous current for various applications.

Maximum Drain-Source On Resistance: 0.6 ohm

Low on-resistance for efficient current flow.

Terminal Position: SINGLE

Simple connection with a single terminal position.

Case Connection: DRAIN

Efficient heat dissipation through the drain connection.

Maximum Time At Peak Reflow Temperature (s): 30

Ideal reflow time for soldering process.

Peak Reflow Temperature °C: 260

High reflow temperature for secure solder joints.

Technical Specifications

Power Field Effect Transistors (FET) NTD600N80S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

24 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

21 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD600N80S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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