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NTD60N02R-35G

Onsemi

NTD60N02R-35G by Onsemi

NTD60N02R-35G by Onsemi is a Power FET with 25V DS Breakdown Voltage, 32A ID, and 0.0105 ohm RDS(ON). It is an N-CHANNEL transistor for SWITCHING applications. The package is RECTANGULAR with PLASTIC/EPOXY body material and features a BUILT-IN DIODE.

Median Price

$0.147

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19,425 parts In-Stock

1+ parts

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$0.140

19,425

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$0.140

Rochester

USA . 18,750 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

18,750

-

$0.159

$0.132

$0.117

Verical

USA . 18,750 parts In-Stock

1+ parts

-

100+ parts

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$0.147

18,750

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$0.147

Distributors (In-Stock)

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Digiode

USA . 2,427 parts In-Stock

1+ parts

$0.124

100+ parts

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2,427

$0.124

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Vyrian

USA . 1,084 parts In-Stock

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$0.130

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1,084

$0.130

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Bristol Electronics

USA . 1,323 parts In-Stock

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1,323

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Distributors (Availability)

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Corphita

USA . 1,596 parts In-Stock

1+ parts

$0.117

100+ parts

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1,596

$0.117

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Corohmni

South Africa . 366 parts In-Stock

1+ parts

$0.130

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366

$0.130

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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Continental Prestige Electronics

USA . 19,425 parts In-Stock

1+ parts

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100+ parts

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$0.119

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19,425

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$0.119

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Problanco Electronics

Mexico . 5,973 parts In-Stock

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5,973

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SupplyDigital Components

Austria . 5,883 parts In-Stock

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5,883

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TANS Electronics

Latvia . 3,718 parts In-Stock

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3,718

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Kulean Microsystems

USA . 1,660 parts In-Stock

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1,660

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UHIMA Technologies

Türkiye . 478 parts In-Stock

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478

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Overview

Enhance your electronic devices' performance with the NTD60N02R-35G by Onsemi, a top-of-the-line Power Field Effect Transistor. Manufactured with precision and expertise, this N-CHANNEL transistor offers unparalleled reliability and efficiency in switching applications. With a maximum drain current of 32 A and a minimum DS breakdown voltage of 25 V, this transistor is designed to handle high-power tasks with ease. Upgrade your devices today and experience the superior quality and value that Onsemi products bring to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type offers lower ON resistance and higher efficiency in switching applications compared to P-CHANNEL, making it a good choice for power FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making the product more convenient for use in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and reliable operation when used in such scenarios.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25 V ensures a safe operating range, protecting the transistor from voltage spikes and potential damage.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier mounting and integration into circuit boards, improving overall convenience during assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable electrical connections in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier controlling of the transistor's conductivity, enhancing its performance in switching applications.

Avalanche Energy Rating (EAS): 60 mJ

High avalanche energy rating of 60 mJ ensures reliability and robustness during high-energy transients, making the product suitable for demanding applications.

No. of Terminals: 3

Having 3 terminals enables easy connection and integration into circuit designs, offering flexibility in various applications.

Package Style (Meter): IN-LINE

In-line package style provides a compact form factor, saving space on the circuit board and enabling dense layouts for efficient PCB designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making the transistor suitable for switching applications requiring precise control.

Transistor Element Material: SILICON

Silicon-based transistor elements provide reliable and consistent performance, ensuring long-term stability and durability in various operating conditions.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, ensuring reliable electrical connections and long-term performance in the product.

Maximum Drain Current (ID): 32 A

High maximum drain current rating of 32 A allows for handling high power loads efficiently, making the product suitable for demanding applications requiring high current capabilities.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low drain-source on resistance ensures minimal power loss and high efficiency during operation, making the product ideal for applications where low resistance is critical.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, reducing complexity in circuit designs and ensuring ease of use in various applications.

Case Connection: DRAIN

Case connection at the drain terminal allows for easy integration into circuit designs, providing a reliable connection point for efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable solder joints and robust assembly, making the product suitable for reflow soldering processes in manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) NTD60N02R-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD60N02R-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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