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NTD6415AN-1G

Onsemi

NTD6415AN-1G by Onsemi

NTD6415AN-1G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 89A IDM, and 0.055 ohm RDS(on). Ideal for applications requiring high drain current handling such as power supplies and motor control systems. Operating in enhancement mode, it features a built-in diode and can withstand up to 175 °C temperature.

Median Price

$0.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 665 parts In-Stock

1+ parts

$1.760

100+ parts

$0.710

1k+ parts

$0.680

10k+ parts

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665

$1.760

$0.710

$0.680

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Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$0.621

1k+ parts

$0.515

10k+ parts

$0.459

750

-

$0.621

$0.515

$0.459

DigiKey

USA . 750 parts In-Stock

1+ parts

-

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$0.530

10k+ parts

$0.530

750

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-

$0.530

$0.530

Verical

USA . 750 parts In-Stock

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-

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$0.698

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750

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$0.698

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Distributors (In-Stock)

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Digiode

USA . 2,437 parts In-Stock

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$0.484

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Vyrian

USA . 3,551 parts In-Stock

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3,551

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Corphita

USA . 1,099 parts In-Stock

1+ parts

$0.458

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1,099

$0.458

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

$0.509

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334

$0.509

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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TANS Electronics

Latvia . 6,659 parts In-Stock

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Kulean Microsystems

USA . 6,543 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,075 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,238 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 1,085 parts In-Stock

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UHIMA Technologies

Türkiye . 856 parts In-Stock

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856

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Continental Prestige Electronics

USA . 750 parts In-Stock

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$0.467

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750

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$0.467

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Problanco Electronics

Mexico . 635 parts In-Stock

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635

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Unleash the power of innovation with the NTD6415AN-1G by Onsemi. Crafted with precision and quality, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability for a wide range of applications. With a single configuration and built-in diode, this N-CHANNEL transistor delivers exceptional value and efficiency. Experience seamless operation and enhanced functionality with the NTD6415AN-1G, setting new standards in power management technology. Elevate your projects to new heights with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design and reduces the need for additional components, making the FET easier to integrate into electronic systems.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage applications, making this FET suitable for a variety of power-related tasks.

Maximum Pulsed Drain Current (IDM): 89 A

Capable of handling high currents in short bursts, which is beneficial for applications requiring power surges.

Maximum Operating Temperature: 175 °C

Can operate efficiently in high-temperature environments, expanding the range of potential applications for this FET.

Technical Specifications

Power Field Effect Transistors (FET) NTD6415AN-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

89 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTD6415AN-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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