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NTD60N02R-1

Onsemi

NTD60N02R-1 by Onsemi

NTD60N02R-1 by Onsemi is a Power FET with 25V DS Breakdown Voltage, 32A Drain Current, and 0.0105 ohm RDS(ON). Ideal for SWITCHING applications due to its N-CHANNEL configuration and 48W power dissipation. Operates in ENHANCEMENT MODE with a max temp of 175 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 2,059 parts In-Stock

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Vyrian

USA . 1,407 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 725 parts In-Stock

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Kulean Microsystems

USA . 8,288 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 1,125 parts In-Stock

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SupplyDigital Components

Austria . 435 parts In-Stock

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Problanco Electronics

Mexico . 357 parts In-Stock

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TANS Electronics

Latvia . 252 parts In-Stock

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Corohmni

South Africa . 199 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 9 parts In-Stock

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Overview

Unlock the power of innovation with the NTD60N02R-1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The NTD60N02R-1 belongs to the Power Field Effect Transistors category, offering exceptional performance in switching applications. With a built-in diode and an impressive avalanche energy rating of 60mJ, this transistor is designed to handle high power dissipation with ease. Trust Onsemi to provide cutting-edge technology that meets your needs for efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and durability, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better characteristics and performance compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection, enhancing the overall performance and reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast and efficient operation.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle higher voltages without breakdown, increasing its versatility and reliability.

Maximum Drain Current (Abs) (ID): 32 A

The high maximum drain current capacity allows for handling of large loads, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs): 48 W

With a maximum power dissipation of 48W, this FET can handle high power levels without overheating, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and fast switching speeds, making this FET a reliable choice for various electronic circuits.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in various thermal conditions, enhancing the durability of the FET.

Maximum Drain-Source On Resistance: 0.0105 ohm

The low on-resistance ensures minimal power loss and efficient operation, making this FET ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD60N02R-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD60N02R-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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