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NTD5803NG

Onsemi

NTD5803NG by Onsemi

NTD5803NG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 228A IDM, and 0.0072 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE and built-in DIODE. Operating at up to 175 °C, this N-CHANNEL transistor has a max power dissipation of 83W in a RECTANGULAR package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,381 parts In-Stock

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Digiode

USA . 649 parts In-Stock

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649

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Problanco Electronics

Mexico . 6,439 parts In-Stock

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6,439

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TANS Electronics

Latvia . 6,351 parts In-Stock

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SupplyDigital Components

Austria . 6,249 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,574 parts In-Stock

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4,574

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Kulean Microsystems

USA . 3,648 parts In-Stock

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Corphita

USA . 724 parts In-Stock

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UHIMA Technologies

Türkiye . 199 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Experience unmatched power and efficiency with the NTD5803NG Power FET by Onsemi. Crafted with precision and quality, this N-CHANNEL transistor offers seamless switching capabilities ideal for a variety of applications. From enhancing performance in electronics to optimizing energy consumption, this single configuration with a built-in diode delivers reliable results every time. Elevate your projects with the value and benefits that this exceptional product brings to the table. Choose Onsemi for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable packaging material ensures reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower RDS(on) values and higher efficiency compared to P-channel FETs.

Minimum DS Breakdown Voltage: 40 V

Suitable for applications requiring high voltage handling capabilities.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering efficient performance.

Maximum Pulsed Drain Current (IDM): 228 A

Capable of handling high current pulses, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 83 W

High power dissipation capability allows for reliable operation even under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low ON resistance for improved performance.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degrading performance, suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD5803NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD5803NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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