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NTD5804NG

Onsemi

NTD5804NG by Onsemi

NTD5804NG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 125A IDM, and 0.0085 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE and 195mJ EAS. With a max power dissipation of 71W and operating temperature of 175 °C, this N-CHANNEL transistor in PLASTIC/EPOXY package is suitable for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,485 parts In-Stock

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Digiode

USA . 371 parts In-Stock

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371

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Kulean Microsystems

USA . 6,500 parts In-Stock

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6,500

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SupplyDigital Components

Austria . 4,617 parts In-Stock

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TANS Electronics

Latvia . 3,626 parts In-Stock

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Corphita

USA . 1,837 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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399

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Problanco Electronics

Mexico . 45 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Unleash the power of the NTD5804NG Power Field Effect Transistor by Onsemi! With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology to meet your switching needs. This N-channel transistor offers a single configuration with a built-in diode, making it ideal for various applications. Experience enhanced performance and efficiency with a maximum drain current of 69A and a low on-resistance of 0.0085 ohm. Trust Onsemi to provide value and innovation in every product, including the versatile NTD5804NG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection, making the product reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-state resistance than P-channel FETs, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the product's efficiency and eliminates the need for additional components, simplifying the design and reducing overall costs.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and high efficiency, making it ideal for power management in a variety of electronic devices.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD5804NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

195 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

69 A

Maximum Drain Current (ID):

69 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

125 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD5804NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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