Loading...

NTD5803NT4G

Onsemi

NTD5803NT4G by Onsemi

NTD5803NT4G by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 76A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 240mJ Avalanche Energy Rating, and 0.0072 ohm On Resistance. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,187

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

Digiode

USA . 1,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,859

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.583

100+ parts

$0.577

1k+ parts

$0.554

10k+ parts

-

500

$0.583

$0.577

$0.554

-

AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$10.540

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$10.540

-

-

-

Metaverse IC Inc.

Canada . 40,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,746

-

-

-

-

Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,350

-

-

-

-

Kulean Microsystems

USA . 6,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,925

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,585

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Corphita

USA . 2,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,188

-

-

-

-

Problanco Electronics

Mexico . 2,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

-

-

-

-

UHIMA Technologies

Türkiye . 668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

668

-

-

-

-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

430

-

-

-

-

SupplyDigital Components

Austria . 254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

254

-

-

-

-

TANS Electronics

Latvia . 211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

211

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the NTD5803NT4G Power Field Effect Transistor by Onsemi. Designed for high-performance switching applications, this N-channel transistor offers unparalleled reliability and efficiency. With a maximum pulsed drain current of 228A and a low on-resistance of 0.0072 ohm, this transistor delivers exceptional performance in a compact package. Trust Onsemi's expertise and innovation to take your projects to the next level. Elevate your designs with the NTD5803NT4G and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the Field Effect Transistor, ensuring it will last a long time in various conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for efficient switching capabilities, making it suitable for a wide range of power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds an extra layer of protection and functionality to the transistor, making it versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Field Effect Transistor is optimized for quick and efficient power control.

Surface Mount: YES

Being surface mountable makes installation easier and saves space, making it a convenient choice for various electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a high minimum breakdown voltage, this transistor can handle higher voltages without malfunctioning or getting damaged.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable performance in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers improved control and efficiency, making this transistor an excellent choice for power management systems.

Maximum Pulsed Drain Current (IDM): 228 A

The high maximum pulsed drain current rating allows for handling sudden surges of power, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 240 mJ

The high avalanche energy rating indicates the transistor's ability to withstand high-energy impacts, adding a level of robustness to the device.

Maximum Drain Current (Abs) (ID): 76 A

With a high maximum drain current rating, this transistor can handle heavy loads and provide consistent performance in power applications.

No. of Terminals: 2

Having only two terminals simplifies the installation process and reduces the chances of errors, making it user-friendly.

Maximum Power Dissipation (Abs): 83 W

The high maximum power dissipation rating ensures the transistor can handle power efficiently and avoid overheating, increasing its reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact designs, making it ideal for modern electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability, making this transistor a premium choice for power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can withstand heat and work reliably in a variety of environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides excellent conductivity and durability, ensuring long-term functionality.

Terminal Finish: TIN

Tin terminal finish offers corrosion resistance and good solderability, ensuring stable connections and longevity.

Maximum Drain-Source On Resistance: 0.0072 ohm

With a low on-resistance, this Field Effect Transistor minimizes power loss and heat generation, improving overall efficiency.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in installation and connectivity options, enhancing the versatility of the transistor.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation, preventing overheating and ensuring stable performance under heavy loads.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and effective soldering, saving time during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can withstand the soldering process without damage, ensuring robust construction.

Technical Specifications

Power Field Effect Transistors (FET) NTD5803NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD5803NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19