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NTD50N03R-1

Onsemi

NTD50N03R-1 by Onsemi

NTD50N03R-1 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 25V DS Breakdown Voltage, 180A IDM, and 0.014 ohm RDS(on). Ideal for high-power switching circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,430 parts In-Stock

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Digiode

USA . 1,389 parts In-Stock

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1,389

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SupplyDigital Components

Austria . 5,803 parts In-Stock

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TANS Electronics

Latvia . 5,737 parts In-Stock

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Problanco Electronics

Mexico . 3,761 parts In-Stock

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Kulean Microsystems

USA . 1,964 parts In-Stock

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Corohmni

South Africa . 287 parts In-Stock

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Corphita

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Overview

Discover the power of the NTD50N03R-1 by Onsemi, a high-quality Power Field Effect Transistor that offers reliability and efficiency in various switching applications. With its N-CHANNEL configuration and enhancement mode operation, this transistor provides superior performance and durability. Whether you're looking to optimize your power management system or enhance your electronic projects, the NTD50N03R-1 is designed to deliver exceptional results. Trust in Onsemi's expertise and choose this transistor for unmatched value and benefits in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the transistor, ensuring a long lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel type transistors are efficient for many applications and offer good performance characteristics.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making this transistor a convenient choice.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25V ensures the transistor can handle higher voltages without failure, making it versatile.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various electronic devices and circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and secure the transistor onto a circuit board.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and efficiency in the switching process.

Maximum Pulsed Drain Current (IDM): 180 A

High maximum pulsed drain current allows the transistor to handle peak loads without overheating or damage.

Avalanche Energy Rating (EAS): 20 mJ

The 20mJ avalanche energy rating indicates the transistor's ability to withstand high energy spikes or surges.

No. of Terminals: 3

Having 3 terminals provides the necessary connections for proper operation and integration into a circuit.

Package Style (Meter): IN-LINE

In-line package style offers a compact form factor, ideal for applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high reliability and performance in various operating conditions.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this transistor can withstand higher temperatures, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon material ensures consistent and stable performance characteristics, making this transistor a reliable choice.

Terminal Finish: TIN LEAD

Tin lead finish on the terminals provides good solderability and conductivity, ensuring secure connections.

Maximum Drain Current (ID): 7.8 A

High maximum drain current rating of 7.8A allows the transistor to handle moderate power loads efficiently.

Maximum Drain-Source On Resistance: 0.014 ohm

Low drain-source on resistance of 0.014 ohm minimizes power loss and improves efficiency in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making it user-friendly.

Case Connection: DRAIN

Having drain as the case connection provides a specific point of reference for the transistor's operation and integration.

Technical Specifications

Power Field Effect Transistors (FET) NTD50N03R-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

7.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD50N03R-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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