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NTD5407NG

Onsemi

NTD5407NG by Onsemi

NTD5407NG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 40V DS Breakdown Voltage, 75A IDM, and 0.026 ohm Drain-Source Resistance. With a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology, it offers high performance in small outline packages.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,173 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 1,103 parts In-Stock

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Metaverse IC Inc.

Canada . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,113 parts In-Stock

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SupplyDigital Components

Austria . 7,898 parts In-Stock

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TANS Electronics

Latvia . 3,157 parts In-Stock

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Problanco Electronics

Mexico . 2,954 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 451 parts In-Stock

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Corohmni

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Corphita

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Kepictronics

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Kulean Microsystems

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Overview

Unleash the power of innovation with the NTD5407NG by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unmatched performance and reliability for your switching applications. With a single configuration and built-in diode, this N-channel transistor ensures seamless operation and efficiency. Experience the value and benefits of Onsemi's cutting-edge technology with the NTD5407NG, delivering maximum pulsing drain current of 75A and minimum DS breakdown voltage of 40V. Take your projects to the next level with this exceptional product from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and thermal stability, making the product suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher switching speed, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against voltage spikes, ensuring reliable performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltages efficiently.

Surface Mount: YES

Surface mount packaging allows for easy assembly on PCBs, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle relatively high voltages, providing protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 75 A

The high pulsed drain current rating ensures the FET can handle short-term high-current loads without failure.

Avalanche Energy Rating (EAS): 150 mJ

The high avalanche energy rating indicates the FET can withstand transient over-voltage conditions without damage, ensuring reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and facilitates efficient heat dissipation, ideal for compact electronic devices.

Maximum Drain-Source On Resistance: 0.026 ohm

The low ON resistance minimizes power loss and heat generation, making the FET highly efficient in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD5407NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

75 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD5407NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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