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NTD5413NT4G

Onsemi

NTD5413NT4G by Onsemi

NTD5413NT4G by Onsemi is an N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 84A and EAS of 135mJ, suitable for high-power operations. With a 0.026 ohm RDS(on), this MOSFET operates in ENHANCEMENT MODE at up to 175 °C, making it versatile for various industrial uses.

Median Price

$0.352

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 398 parts In-Stock

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Verical

USA . 398 parts In-Stock

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Digiode

USA . 463 parts In-Stock

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$0.334

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Vyrian

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Sensible Micro Corp

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Ampacity Inc.

Singapore . 48 parts In-Stock

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Corphita

USA . 1,130 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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AZTECH Wire

Italy . 155 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,957 parts In-Stock

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Problanco Electronics

Mexico . 6,141 parts In-Stock

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TANS Electronics

Latvia . 5,982 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 3,708 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Kepictronics

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UHIMA Technologies

Türkiye . 256 parts In-Stock

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Overview

Unleash the power of the NTD5413NT4G by Onsemi, a top-of-the-line Power FET designed for high-performance switching applications. Manufactured by the trusted brand Onsemi, this N-CHANNEL transistor offers unparalleled quality and reliability. Ideal for various industries, this single-channel FET with a built-in diode provides superior efficiency and performance. Say goodbye to overheating and inefficiency with the NTD5413NT4G, delivering high power dissipation and low on-resistance. Upgrade your systems today and experience the difference with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers built-in protection against reverse current flow.

Transistor Application: SWITCHING

Ideal for fast switching applications, making it suitable for use in power supplies and motor control systems.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

Provides a high level of voltage tolerance, ensuring reliable operation in high-voltage applications.

Maximum Pulsed Drain Current (IDM): 84 A

Capable of handling high current surges, making it suitable for applications with varying load requirements.

Maximum Power Dissipation (Abs): 68 W

Can dissipate heat efficiently, allowing for continuous operation under heavy load conditions.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, ensuring reliable performance in demanding environments.

Maximum Drain-Source On Resistance: 0.026 ohm

Low on-resistance results in minimal power loss and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD5413NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

135 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD5413NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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