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NTD4855NT4G

Onsemi

NTD4855NT4G by Onsemi

NTD4855NT4G by Onsemi is an N-CHANNEL FET with a 25V DS Breakdown Voltage and 197A Pulsed Drain Current, ideal for SWITCHING applications. It features a 0.006 ohm Drain-Source On Resistance, 66.7W Power Dissipation, and operates in ENHANCEMENT MODE at up to 175 °C.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 209,901 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

$0.318

10k+ parts

$0.283

209,901

-

$0.383

$0.318

$0.283

Verical

USA . 107,500 parts In-Stock

1+ parts

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$0.398

10k+ parts

$0.354

107,500

-

-

$0.398

$0.354

Distributors (In-Stock)

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Digiode

USA . 1,933 parts In-Stock

1+ parts

$0.298

100+ parts

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1,933

$0.298

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Vyrian

USA . 4,280 parts In-Stock

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4,280

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Cyclops Electronics Ltd

UK . 2,756 parts In-Stock

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2,756

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Prism Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Corphita

USA . 1,705 parts In-Stock

1+ parts

$0.283

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1,705

$0.283

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$0.314

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173

$0.314

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AZTECH Wire

Italy . 935 parts In-Stock

1+ parts

$17.280

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935

$17.280

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Continental Prestige Electronics

USA . 209,901 parts In-Stock

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$0.288

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209,901

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$0.288

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Perfect Parts

USA . 6,066 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,532 parts In-Stock

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Problanco Electronics

Mexico . 4,220 parts In-Stock

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TANS Electronics

Latvia . 1,635 parts In-Stock

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Kulean Microsystems

USA . 1,522 parts In-Stock

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Kepictronics

USA . 1,115 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 897 parts In-Stock

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897

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SupplyDigital Components

Austria . 561 parts In-Stock

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561

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Futuretech Components

Singapore . 510 parts In-Stock

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510

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Overview

Elevate your power applications with the NTD4855NT4G by Onsemi. Crafted with precision and quality, this N-Channel Power Field Effect Transistor offers unmatched performance and reliability. Ideal for switching applications, this transistor boasts a high pulsing current capacity and low on-resistance, ensuring efficiency and durability. With its built-in diode and small outline package, the NTD4855NT4G provides convenience and versatility in design. Trust Onsemi for superior technology and elevate your projects to new heights with this exceptional FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a popular choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better efficiency in switching applications and protects against reverse current flow, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient response in controlling current flow.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 25 V

With a breakdown voltage of 25V, this FET can handle higher voltages, providing protection against overloads or voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and soldering on circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering connections, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of current flow and are ideal for use in amplifiers, switches, and other applications where precise control is required.

Maximum Pulsed Drain Current (IDM): 197 A

With a high pulsed drain current rating, this FET can handle sudden surge currents, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 220 mJ

The high avalanche energy rating ensures that the FET can withstand short-duration high-energy pulses, improving ruggedness and reliability.

Maximum Drain Current (Abs) (ID): 98 A

With a high maximum drain current rating, this FET can handle continuous high current flow without overheating or failing prematurely.

No. of Terminals: 2

Simple two-terminal design for easy integration and connection in circuit designs.

Maximum Power Dissipation (Abs): 66.7 W

The high maximum power dissipation rating allows the FET to dissipate heat effectively, ensuring stable performance under high load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style for space-saving and compact designs, suitable for portable and small form-factor applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high efficiency, low power consumption, and fast switching speeds, making them ideal for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring reliable operation in harsh environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, stability, and reliability, making them a popular choice for many electronic applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability of the electrical connections.

Maximum Drain Current (ID): 14 A

With a high drain current rating, this FET can handle moderate to high current flow, suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.006 ohm

Low on-resistance means less power dissipation and higher efficiency, making this FET ideal for high current applications where low losses are critical.

Terminal Position: SINGLE

Single terminal position simplifies connection and ensures proper orientation during installation, reducing the risk of errors.

Case Connection: DRAIN

Drain connection for easy integration into circuit designs, allowing for efficient current flow control and management.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering connections, ensuring stable electrical connections during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD4855NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

98 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

197 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4855NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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