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NTB5405NG

Onsemi

NTB5405NG by Onsemi

The Onsemi NTB5405NG is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 116A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 280A Pulsed Drain Current, and 0.0058 ohm On Resistance. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 33,000 parts In-Stock

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Vyrian

USA . 6,300 parts In-Stock

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Digiode

USA . 2,424 parts In-Stock

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AZTECH Wire

Italy . 527 parts In-Stock

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$14.310

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527

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,598 parts In-Stock

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Problanco Electronics

Mexico . 3,575 parts In-Stock

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SupplyDigital Components

Austria . 2,046 parts In-Stock

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Kulean Microsystems

USA . 1,321 parts In-Stock

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Corohmni

South Africa . 324 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

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Overview

Experience the power of innovation with the NTB5405NG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-of-the-line Power Field Effect Transistors (FET) that are perfect for numerous switching applications. With a built-in diode and high-quality construction, this N-CHANNEL transistor offers unmatched reliability and performance. Whether you're looking for enhanced efficiency or increased power handling capabilities, the NTB5405NG provides the value and benefits you need. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher conductivity, making this transistor efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient circuit design, simplifying the overall setup and enhancing performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power dissipation, making it ideal for high-performance systems.

Maximum Drain-Source On Resistance: 0.0058 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, ensuring efficient operation and high reliability.

Maximum Power Dissipation (Abs): 150 W

The high power dissipation allows this transistor to handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this transistor can withstand harsh environments and extreme conditions, ensuring reliable performance in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB5405NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

116 A

Maximum Drain Current (ID):

116 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB5405NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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