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NTB5D0N15MC

Onsemi

NTB5D0N15MC by Onsemi

NTB5D0N15MC by Onsemi is a N-CHANNEL FET with 150V DS Breakdown Voltage, ideal for SWITCHING applications. It features 761A IDM and 1014mJ EAS, suitable for high-power operations. With 0.005 ohm RDS(on) and 214W Pdiss, it ensures efficient performance in ENHANCEMENT MODE operation.

Median Price

$5.200

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,953 parts In-Stock

1+ parts

$5.200

100+ parts

$2.660

1k+ parts

$2.490

10k+ parts

-

1,953

$5.200

$2.660

$2.490

-

Mouser Electronics

USA . 1,407 parts In-Stock

1+ parts

$7.050

100+ parts

$3.440

1k+ parts

$3.070

10k+ parts

-

1,407

$7.050

$3.440

$3.070

-

DigiKey

USA . 412 parts In-Stock

1+ parts

$7.050

100+ parts

$3.438

1k+ parts

-

10k+ parts

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412

$7.050

$3.438

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-

Newark

USA . 1,953 parts In-Stock

1+ parts

$7.260

100+ parts

$3.540

1k+ parts

-

10k+ parts

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1,953

$7.260

$3.540

-

-

Element14

Singapore . 1,953 parts In-Stock

1+ parts

-

100+ parts

$3.700

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-

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1,953

-

$3.700

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Arrow

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.747

10k+ parts

$3.369

800

-

-

$3.747

$3.369

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.708

10k+ parts

$3.334

800

-

-

$3.708

$3.334

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 66 parts In-Stock

1+ parts

$4.284

100+ parts

-

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66

$4.284

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-

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Vyrian

USA . 1,704 parts In-Stock

1+ parts

$4.510

100+ parts

-

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10k+ parts

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1,704

$4.510

-

-

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IBS Electronics

USA . 37,600 parts In-Stock

1+ parts

$6.676

100+ parts

$6.339

1k+ parts

-

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37,600

$6.676

$6.339

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Chip Stock

USA . 49,000 parts In-Stock

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49,000

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NAC Semi

USA . 30,400 parts In-Stock

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-

100+ parts

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$8.660

10k+ parts

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30,400

-

-

$8.660

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,269 parts In-Stock

1+ parts

$4.059

100+ parts

-

1k+ parts

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1,269

$4.059

-

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Corohmni

South Africa . 106 parts In-Stock

1+ parts

$4.400

100+ parts

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106

$4.400

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iodParts Technologies Inc.

India . 68,032 parts In-Stock

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68,032

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QUARKTWIN TECHNOLOGY LTD

USA . 24,016 parts In-Stock

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24,016

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Microchip USA

USA . 9,437 parts In-Stock

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9,437

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TANS Electronics

Latvia . 6,366 parts In-Stock

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6,366

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Kulean Microsystems

USA . 4,117 parts In-Stock

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4,117

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Problanco Electronics

Mexico . 3,072 parts In-Stock

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3,072

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Perfect Parts

USA . 587 parts In-Stock

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587

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SupplyDigital Components

Austria . 494 parts In-Stock

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494

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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388

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Authorized Procurement Solutions

USA . 56 parts In-Stock

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56

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GreenTree Electronics

Israel . 6 parts In-Stock

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6

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Overview

Discover the NTB5D0N15MC by Onsemi, a top-quality Power FET that stands out in performance and reliability. With Onsemi's stellar reputation in semiconductor manufacturing, this N-Channel FET with a built-in diode is ideal for switching applications. Offering enhanced mode operation and a maximum power dissipation of 214W, this transistor provides exceptional value and benefits to customers. From its high breakdown voltage of 150V to its low drain-source on resistance of 0.005 ohm, the NTB5D0N15MC delivers superior efficiency and durability. Upgrade your electronic designs with this innovative solution from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the transistor, making it suitable for various application environments.

Minimum DS Breakdown Voltage: 150 V

The high minimum breakdown voltage ensures reliable operation and protection against voltage spikes, making it suitable for high voltage applications.

Maximum Pulsed Drain Current (IDM): 761 A

The high pulsed drain current rating allows the transistor to handle high current pulses, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 214 W

The high power dissipation rating ensures the transistor can handle high power levels without overheating, making it suitable for high power applications.

Maximum Drain Current (ID): 139 A

The high maximum drain current rating allows the transistor to handle high continuous currents, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.005 ohm

The low on-resistance ensures minimal power loss and efficient operation, making it suitable for high efficiency applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the transistor to operate in high temperature environments, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB5D0N15MC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1014 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

139 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

761 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB5D0N15MC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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