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NTB5605PT4

Onsemi

NTB5605PT4 by Onsemi

NTB5605PT4 by Onsemi is a P-CHANNEL FET for SWITCHING applications. It features a 60V DS Breakdown Voltage, 55A IDM, and 0.14 ohm RDS(on). With a max power dissipation of 73.5W and operating temperature up to 150 °C, it's ideal for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,177 parts In-Stock

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Digiode

USA . 713 parts In-Stock

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AZTECH Wire

Italy . 368 parts In-Stock

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$16.980

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368

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Kepictronics

USA . 20,000 parts In-Stock

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Problanco Electronics

Mexico . 7,933 parts In-Stock

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SupplyDigital Components

Austria . 3,390 parts In-Stock

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TANS Electronics

Latvia . 2,697 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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883

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Corphita

USA . 871 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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Kulean Microsystems

USA . 120 parts In-Stock

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Overview

Enhance the efficiency of your power switching applications with the NTB5605PT4 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Power Field Effect Transistors (FET). This P-CHANNEL transistor, configured as single with a built-in diode, is ideal for various switching applications. With a maximum pulsed drain current of 55 A and a low on-resistance of 0.14 ohm, this transistor offers exceptional performance and durability. Trust Onsemi to deliver value and innovation with the NTB5605PT4, providing you with the competitive edge you need in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current-carrying capabilities, making them suitable for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient reverse current flow handling and simplifies circuit design by eliminating the need for an external diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient control of power flow within a circuit.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation, making it ideal for compact and densely populated circuit boards.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle relatively high voltages, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 18.5 A

Capable of handling high currents, making it suitable for power applications that require robust and reliable performance.

Maximum Drain-Source On Resistance: 0.14 ohm

Low on-resistance minimizes power loss and heat generation, ensuring efficient operation and high performance.

Maximum Power Dissipation (Abs): 73.5 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, suitable for applications where temperature fluctuations are common or where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NTB5605PT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

338 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

18.5 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

55 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB5605PT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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