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NTB52N10T4G

Onsemi

NTB52N10T4G by Onsemi

NTB52N10T4G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 52A ID, and 0.03 ohm RDS(ON). Ideal for SWITCHING applications, it features a built-in DIODE and can handle up to 156A IDM. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 178W.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 71,000 parts In-Stock

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Vyrian

USA . 12,579 parts In-Stock

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Digiode

USA . 1,985 parts In-Stock

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Electronics Depot

USA . 64 parts In-Stock

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Connect4Technologies Inc.

Canada . 45 parts In-Stock

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AZTECH Wire

Italy . 531 parts In-Stock

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$17.890

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,699 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 1,904 parts In-Stock

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TANS Electronics

Latvia . 1,703 parts In-Stock

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Kepictronics

USA . 1,657 parts In-Stock

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SupplyDigital Components

Austria . 1,516 parts In-Stock

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Futuretech Components

Singapore . 512 parts In-Stock

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Corohmni

South Africa . 381 parts In-Stock

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Kulean Microsystems

USA . 328 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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Corphita

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Overview

Enhance the performance of your power switching applications with the NTB52N10T4G by Onsemi. Manufactured with top-quality materials and advanced technology, this N-CHANNEL Power FET offers a reliable and efficient solution for your circuit design needs. With a high DS Breakdown Voltage of 100V and a low ON resistance of 0.03 ohm, this transistor ensures optimal power management with a maximum drain current of 52A. Whether you're working on industrial equipment, automotive systems, or consumer electronics, this versatile component is sure to deliver superior performance, making it an essential choice for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, perfect for various electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better performance and efficiency in a variety of circuits, making this product a reliable choice.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient operation.

Surface Mount: YES

Being suitable for surface mount technology, this transistor allows for easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this transistor can handle high voltages without failing, ensuring safety and reliability.

Maximum Pulsed Drain Current (IDM): 156 A

The high pulsed drain current rating of 156A allows the transistor to handle short bursts of high current, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 178 W

With a maximum power dissipation of 178W, this transistor can safely dissipate heat generated during operation, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures that the transistor can operate in a wide range of environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NTB52N10T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB52N10T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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