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NTB5405NT4G

Onsemi

NTB5405NT4G by Onsemi

NTB5405NT4G by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 280A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0058 ohm RDS(on), and 175°C max operating temp.

Median Price

$1.029

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 15,096 parts In-Stock

1+ parts

-

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$0.570

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$0.570

Flip Electronics (Authorized)

USA . 15,096 parts In-Stock

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15,096

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Farnell

UK . 14,400 parts In-Stock

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$1.200

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14,400

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$1.200

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Rochester

USA . 14,240 parts In-Stock

1+ parts

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100+ parts

$1.010

1k+ parts

$0.838

10k+ parts

$0.747

14,240

-

$1.010

$0.838

$0.747

Verical

USA . 14,240 parts In-Stock

1+ parts

-

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$1.048

10k+ parts

$0.934

14,240

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-

$1.048

$0.934

Distributors (In-Stock)

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Vyrian

USA . 902 parts In-Stock

1+ parts

$0.730

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902

$0.730

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Digiode

USA . 2,383 parts In-Stock

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$0.827

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2,383

$0.827

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Chip Stock

USA . 51,000 parts In-Stock

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Flip Electronics

USA . 15,096 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 433 parts In-Stock

1+ parts

$0.730

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433

$0.730

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Corphita

USA . 103 parts In-Stock

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$0.784

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103

$0.784

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Benley Electronics

USA . 3 parts In-Stock

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$1.750

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3

$1.750

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Microchip USA

USA . 6,199 parts In-Stock

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$5.460

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$5.460

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Continental Prestige Electronics

USA . 14,400 parts In-Stock

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$0.949

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$0.949

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TANS Electronics

Latvia . 7,252 parts In-Stock

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Kulean Microsystems

USA . 3,949 parts In-Stock

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3,949

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,576 parts In-Stock

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SupplyDigital Components

Austria . 2,048 parts In-Stock

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Problanco Electronics

Mexico . 1,559 parts In-Stock

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1,559

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Kepictronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 419 parts In-Stock

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Overview

Discover the power and efficiency of the NTB5405NT4G by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor offers unmatched performance and reliability. With a maximum pulsed drain current of 280A and a low on-resistance of 0.0058 ohms, this transistor ensures seamless operation even in demanding conditions. Trust Onsemi to provide you with innovative solutions that exceed expectations and elevate your projects to new heights. Choose the NTB5405NT4G for unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand high temperatures, making the product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power applications due to their high efficiency and low resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and reliability in such scenarios.

Surface Mount: YES

The surface mount feature allows for easy and space-saving integration onto circuit boards.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for various power applications.

Maximum Pulsed Drain Current (IDM): 280 A

The high pulsed drain current rating allows for handling high current spikes effectively.

Avalanche Energy Rating (EAS): 800 mJ

The high avalanche energy rating ensures protection against voltage and current spikes, enhancing reliability.

Maximum Drain Current (Abs) (ID): 116 A

The high drain current rating allows for handling large currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this FET can handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, ensuring reliability in various environments.

Maximum Drain-Source On Resistance: 0.0058 ohm

The low on-resistance minimizes power loss and heat generation, making the FET efficient in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB5405NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

116 A

Maximum Drain Current (ID):

116 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB5405NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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