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FDB8444

Onsemi

FDB8444 by Onsemi

The Onsemi FDB8444 is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Drain Current of 70A, Max Power Dissipation of 167W, and an Operating Temperature up to 175 °C. The transistor has a built-in DIODE and comes in a PLASTIC/EPOXY package suitable for surface mount configurations.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 166,048 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.050

10k+ parts

$0.940

166,048

-

$1.270

$1.050

$0.940

DigiKey

USA . 165,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.590

10k+ parts

-

165,541

-

-

$1.590

-

Verical

USA . 137,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.175

137,860

-

-

$1.313

$1.175

Flip Electronics (Authorized)

USA . 35,200 parts In-Stock

1+ parts

-

100+ parts

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35,200

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Distributors (In-Stock)

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Digiode

USA . 2,098 parts In-Stock

1+ parts

$1.036

100+ parts

-

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-

10k+ parts

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2,098

$1.036

-

-

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Vyrian

USA . 1,914 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

$1.090

-

-

-

Bristol Electronics

USA . 800 parts In-Stock

1+ parts

$2.424

100+ parts

$1.139

1k+ parts

$1.042

10k+ parts

-

800

$2.424

$1.139

$1.042

-

Flip Electronics

USA . 29,600 parts In-Stock

1+ parts

-

100+ parts

-

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29,600

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Chip Stock

USA . 4,700 parts In-Stock

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4,700

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-

-

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ACDS - Activité Composants Distribution Service

France . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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800

-

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Dan-Mar Components

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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800

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,329 parts In-Stock

1+ parts

$0.981

100+ parts

-

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-

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1,329

$0.981

-

-

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Corohmni

South Africa . 398 parts In-Stock

1+ parts

$1.090

100+ parts

-

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398

$1.090

-

-

-

Andel Nordic

Denmark . 3,396 parts In-Stock

1+ parts

$9.121

100+ parts

-

1k+ parts

$8.756

10k+ parts

$8.756

3,396

$9.121

-

$8.756

$8.756

A-Z Elektronik GmbH

Germany . 5,382 parts In-Stock

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5,382

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RC Electronics

USA . 5,000 parts In-Stock

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$1.190

1k+ parts

$1.120

10k+ parts

$1.100

5,000

-

$1.190

$1.120

$1.100

Alle Elektronik GmbH

Germany . 3,588 parts In-Stock

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3,588

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Supply Digital

USA . 2,859 parts In-Stock

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2,859

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TANS Electronics

Latvia . 1,888 parts In-Stock

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1,888

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Northwest PG Solutions

USA . 1,715 parts In-Stock

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1,715

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SupplyDigital Components

Austria . 1,647 parts In-Stock

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1,647

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Perfect Parts

USA . 896 parts In-Stock

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896

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Kepictronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 632 parts In-Stock

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632

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Problanco Electronics

Mexico . 392 parts In-Stock

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392

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Native Components

USA . 310 parts In-Stock

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310

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Kulean Microsystems

USA . 70 parts In-Stock

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70

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Overview

Unlock the power of efficient switching with the FDB8444 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance in a compact package. Ideal for a wide range of applications, from industrial to automotive, this transistor provides reliable operation and enhanced functionality. Experience the benefits of high-quality design and superior technology with the FDB8444, delivering value and efficiency to customers seeking top-notch performance in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower ON resistances and higher electron mobility, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it efficient and reliable.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Drain Current (Abs) (ID): 70 A

With a high maximum drain current rating, this FET can handle high current loads, making it suitable for power applications that require significant current handling capacity.

Maximum Power Dissipation (Abs): 167 W

This high power dissipation rating ensures the FET can reliably handle high power levels without overheating, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate effectively in a wide range of environmental conditions without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) FDB8444 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

307 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

9.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB8444 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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