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FDB8832

Onsemi

FDB8832 by Onsemi

FDB8832 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 34A ID. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0022 ohm RDS(on), and 175°C max operating temp. Perfect for high-power circuit designs requiring efficient switching capabilities in compact layouts.

Median Price

$1.960

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

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$1.960

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1

$1.960

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Arrow

USA . 1 parts In-Stock

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$1.965

100+ parts

$1.199

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1

$1.965

$1.199

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DigiKey

USA . 46,387 parts In-Stock

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$0.230

46,387

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$0.230

Flip Electronics (Authorized)

USA . 46,387 parts In-Stock

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46,387

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Rochester

USA . 1,648 parts In-Stock

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$1.860

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$1.670

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$1.570

1,648

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$1.860

$1.670

$1.570

Verical

USA . 1,277 parts In-Stock

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$2.175

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1,277

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$2.175

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Distributors (In-Stock)

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Digiode

USA . 769 parts In-Stock

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$0.609

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769

$0.609

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Nova Conductors

Japan . 150 parts In-Stock

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$2.757

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150

$2.757

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Flip Electronics

USA . 46,387 parts In-Stock

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46,387

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Vyrian

USA . 8,328 parts In-Stock

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Chip Stock

USA . 2,750 parts In-Stock

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2,750

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Prism Electronics

USA . 605 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 7,931 parts In-Stock

1+ parts

$0.218

100+ parts

$0.213

1k+ parts

$0.211

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7,931

$0.218

$0.213

$0.211

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Ampacity Inc.

Singapore . 7,922 parts In-Stock

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$0.218

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$0.218

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Aztec Data Supply Inc.

USA . 2,991 parts In-Stock

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$0.409

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2,991

$0.409

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Corphita

USA . 1,567 parts In-Stock

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$0.577

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1,567

$0.577

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Corohmni

South Africa . 64 parts In-Stock

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$0.641

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64

$0.641

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Argo Parts USA

USA . 4,168 parts In-Stock

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$2.757

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4,168

$2.757

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Continental Prestige Electronics

USA . 2,156 parts In-Stock

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$2.757

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$2.701

2,156

$2.757

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$2.701

Perfect Parts

USA . 16,510 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,433 parts In-Stock

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TANS Electronics

Latvia . 3,078 parts In-Stock

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Problanco Electronics

Mexico . 2,508 parts In-Stock

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SupplyDigital Components

Austria . 1,693 parts In-Stock

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Supply Digital

USA . 1,153 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$2.701

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$2.619

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$2.564

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$2.619

$2.564

Alle Elektronik GmbH

Germany . 915 parts In-Stock

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UHIMA Technologies

Türkiye . 769 parts In-Stock

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Microchip USA

USA . 229 parts In-Stock

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Kepictronics

USA . 150 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 13 parts In-Stock

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Montclair Electronics, Inc.

USA . 6 parts In-Stock

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Overview

Experience the power of high-quality electronics with the FDB8832 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and reliability in their products. The FDB8832, part of the Power Field Effect Transistors (FET) category, offers unmatched value with its switching capabilities and built-in diode configuration. Ideal for a range of applications, this N-channel transistor guarantees efficient operation and maximum power dissipation. Trust Onsemi for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for a variety of applications and environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and higher efficiency compared to P-Channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse voltage spikes, enhancing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and efficient operation.

Avalanche Energy Rating (EAS): 1246 mJ

With a high avalanche energy rating, this transistor can withstand high energy spikes, ensuring reliability and robust performance in demanding conditions.

Maximum Drain Current (Abs) (ID): 34 A

The high maximum drain current rating allows for handling higher power levels, making it suitable for applications requiring high current loads.

Maximum Power Dissipation (Abs): 300 W

With a high power dissipation rating, this transistor can handle high power levels without overheating, ensuring reliable operation in demanding conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the transistor to operate in high-temperature environments without compromising performance or reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDB8832 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1246 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

34 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB8832 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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