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NTB45N06T4G

Onsemi

NTB45N06T4G by Onsemi

NTB45N06T4G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, 45A Max ID, and 0.026 ohm RDS(on). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 125W and can handle up to 150A IDM.

Median Price

$0.968

Lifecycle Status

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11

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1k+

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Chip1Stop

Japan . 2 parts In-Stock

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$3.750

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$3.750

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Verical

USA . 521 parts In-Stock

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$0.844

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521

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$0.844

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Rochester

USA . 121 parts In-Stock

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$0.968

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$0.804

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$0.717

121

-

$0.968

$0.804

$0.717

Distributors (In-Stock)

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Digiode

USA . 1,025 parts In-Stock

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$0.754

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$0.754

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Nova Conductors

Japan . 900 parts In-Stock

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$0.862

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$0.862

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Chip Stock

USA . 10,300 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,600 parts In-Stock

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Vyrian

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Microfarads

USA . 180 parts In-Stock

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Bristol Electronics

USA . 140 parts In-Stock

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$1.307

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$1.307

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EPE Components Inc.

USA . 5 parts In-Stock

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Ampacity Inc.

Singapore . 115 parts In-Stock

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$0.670

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115

$0.670

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Corphita

USA . 421 parts In-Stock

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$0.715

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$0.715

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Corohmni

South Africa . 308 parts In-Stock

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$0.794

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$0.794

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Argo Parts USA

USA . 4,266 parts In-Stock

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$0.862

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$0.862

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Netroflash

USA . 100 parts In-Stock

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$0.862

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$0.862

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Continental Prestige Electronics

USA . 1,813 parts In-Stock

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$1.240

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$0.817

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$1.240

$0.817

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AZTECH Wire

Italy . 369 parts In-Stock

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$12.979

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Perfect Parts

USA . 23,199 parts In-Stock

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Problanco Electronics

Mexico . 6,100 parts In-Stock

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ChipstoGo Electronic ltd

UK . 5,600 parts In-Stock

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SupplyDigital Components

Austria . 4,198 parts In-Stock

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Kulean Microsystems

USA . 2,943 parts In-Stock

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TANS Electronics

Latvia . 2,121 parts In-Stock

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Lixinc

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Kepictronics

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UHIMA Technologies

Türkiye . 391 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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iodParts Technologies Inc.

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Overview

Power up your projects with the NTB45N06T4G by Onsemi. Manufactured with precision and reliability, this N-CHANNEL FET is perfect for a variety of switching applications. With a high DS breakdown voltage of 60V and a maximum drain current of 45A, this transistor offers exceptional performance and durability. Say goodbye to overheating issues with its maximum power dissipation of 125W. Whether you're designing power supplies, motor controls, or lighting systems, this FET is a game-changer. Trust Onsemi for quality products that deliver value and efficiency every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities, allowing for better control and performance in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the transistor, reducing component count and potential points of failure.

Transistor Application: SWITCHING

Ideal for applications where high-speed switching is required, such as power supplies and motor control.

Surface Mount: YES

Enables easy and reliable integration onto circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

Withstands high voltage levels, making it suitable for use in power management circuits and industrial applications.

Maximum Pulsed Drain Current (IDM): 150 A

Capable of handling high current surges, ensuring efficient power delivery and performance under load.

Maximum Drain-Source On Resistance: 0.026 ohm

Offers low on-resistance, leading to reduced power dissipation and improved efficiency in switching applications.

Maximum Power Dissipation (Abs): 125 W

Can dissipate heat effectively, prolonging the lifespan of the component and maintaining stable operation.

Maximum Operating Temperature: 175 °C

Operates reliably at high temperatures, suitable for industrial and automotive applications where thermal management is crucial.

Technical Specifications

Power Field Effect Transistors (FET) NTB45N06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB45N06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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