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NTB45N06T4

Onsemi

NTB45N06T4 by Onsemi

NTB45N06T4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 45A ID, and 0.026 ohm RDS(on). Ideal for SWITCHING applications due to its 150A IDM and 240mJ EAS ratings. Package style is SMALL OUTLINE with GULL WING terminals.

Median Price

$4.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 800 parts In-Stock

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$4.670

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Vyrian

USA . 1,143 parts In-Stock

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Digiode

USA . 946 parts In-Stock

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First Choice Components Inc.

USA . 800 parts In-Stock

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800

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Distributors (Availability)

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Component Stockers USA

USA . 5,193 parts In-Stock

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$0.390

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$0.370

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$0.360

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Corohmni

South Africa . 486 parts In-Stock

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Corphita

USA . 2,310 parts In-Stock

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TANS Electronics

Latvia . 2,228 parts In-Stock

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Kulean Microsystems

USA . 2,057 parts In-Stock

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Problanco Electronics

Mexico . 1,831 parts In-Stock

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SupplyDigital Components

Austria . 948 parts In-Stock

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UHIMA Technologies

Türkiye . 623 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi's NTB45N06T4 Power Field Effect Transistor (FET). With a maximum drain current of 45A and a low drain-source on resistance of 0.026 ohm, this N-channel transistor is perfect for switching applications. Its single configuration with built-in diode and small outline package shape make it easy to integrate into your designs. Trust in Onsemi's expertise in semiconductor technology and elevate the performance of your electronic devices with the NTB45N06T4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the FET, making it reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally perform better in power applications compared to P-Channel FETs, making this a suitable choice for switching applications.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages safely, making it versatile for various applications.

Maximum Pulsed Drain Current (IDM): 150 A

Capable of handling high current pulses, ideal for applications where there are occasional surges in current.

Maximum Power Dissipation (Abs): 125 W

Can dissipate a relatively high amount of power without overheating, ensuring stable performance under load.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation, suitable for demanding environments.

Maximum Drain-Source On Resistance: 0.026 ohm

Low on-resistance results in minimal power loss and efficient switching, making it energy-efficient.

Technical Specifications

Power Field Effect Transistors (FET) NTB45N06T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB45N06T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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