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NTB45N06

Onsemi

NTB45N06 by Onsemi

NTB45N06 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 45A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 150A Pulsed Drain Current, and 0.026 ohm On Resistance. The transistor operates in ENHANCEMENT MODE with a max power dissipation of 125W in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,443 parts In-Stock

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Digiode

USA . 980 parts In-Stock

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Cyclops Electronics Ltd

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Component Stockers USA

USA . 8,298 parts In-Stock

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$13.380

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$12.710

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$12.300

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,562 parts In-Stock

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Kulean Microsystems

USA . 4,710 parts In-Stock

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Problanco Electronics

Mexico . 4,333 parts In-Stock

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SupplyDigital Components

Austria . 1,961 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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Corphita

USA . 117 parts In-Stock

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GreenTree Electronics

Israel . 103 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Overview

Discover the NTB45N06 by Onsemi, a top-quality Power FET that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this N-CHANNEL transistor with built-in diode is perfect for switching applications. Its high power dissipation and low on resistance make it ideal for a wide range of projects, ensuring maximum efficiency and durability. Upgrade your electronics with the NTB45N06 and experience the difference Onsemi quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher efficiency, making them suitable for various switching applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows the FET to handle higher voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 150 A

The high pulsed drain current rating ensures the FET can handle temporary high-current loads without damage.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this FET can handle high power applications without overheating.

Maximum Operating Temperature: 175 °C

The FET can operate effectively at high temperatures, making it suitable for demanding environments.

Maximum Drain-Source On Resistance: 0.026 ohm

The low on-resistance helps minimize power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB45N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB45N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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