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NTB4302T4

Onsemi

NTB4302T4 by Onsemi

The Onsemi NTB4302T4 is a N-CHANNEL FET with 30V DS Breakdown Voltage and 175A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.0093 ohm RDS(on), and 80W Pdiss. Suitable for surface mount with GULL WING terminals, it operates in ENHANCEMENT MODE up to 150 °C.

Median Price

$0.343

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,570 parts In-Stock

1+ parts

-

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$0.290

4,570

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$0.290

Rochester

USA . 2,216 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

2,216

-

$0.343

$0.285

$0.254

Verical

USA . 1,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.386

10k+ parts

$0.318

1,646

-

-

$0.386

$0.318

Distributors (In-Stock)

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Digiode

USA . 2,442 parts In-Stock

1+ parts

$0.268

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2,442

$0.268

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Vyrian

USA . 1,811 parts In-Stock

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$0.282

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1,811

$0.282

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PC Components Company LLC

USA . 22 parts In-Stock

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Bristol Electronics

USA . 22 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,346 parts In-Stock

1+ parts

$0.254

100+ parts

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2,346

$0.254

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Corohmni

South Africa . 87 parts In-Stock

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$0.282

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87

$0.282

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,284 parts In-Stock

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Problanco Electronics

Mexico . 8,241 parts In-Stock

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SupplyDigital Components

Austria . 8,057 parts In-Stock

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TANS Electronics

Latvia . 6,045 parts In-Stock

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Continental Prestige Electronics

USA . 4,570 parts In-Stock

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$0.258

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4,570

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$0.258

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Kulean Microsystems

USA . 3,679 parts In-Stock

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3,679

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UHIMA Technologies

Türkiye . 63 parts In-Stock

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63

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Overview

Unlock the power of high-quality innovation with the NTB4302T4 by Onsemi, a cutting-edge Power Field Effect Transistor that delivers exceptional performance in switching applications. Manufactured by Onsemi, known for their top-notch products, this N-CHANNEL FET offers customers unrivaled reliability and efficiency. With a built-in diode, maximum pulsing drain current of 175 A, and a minimum breakdown voltage of 30V, this transistor is perfect for various electronic projects. Elevate your designs with the NTB4302T4 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction makes the product lightweight and durable, ideal for use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching capabilities, making this product suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the transistor, providing reverse current protection and simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow within a circuit.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly processes.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions and maintain stable performance.

Technical Specifications

Power Field Effect Transistors (FET) NTB4302T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB4302T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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