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NTB4302T4G

Onsemi

NTB4302T4G by Onsemi

NTB4302T4G by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, 175A IDM, and 0.0093 ohm RDS. Ideal for SWITCHING applications, it features a built-in DIODE in a PLASTIC/EPOXY package with GULL WING terminals. Operating in ENHANCEMENT MODE at up to 150 °C, it offers high power dissipation of 80W.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,584 parts In-Stock

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Digiode

USA . 1,875 parts In-Stock

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1,875

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AZTECH Wire

Italy . 1,105 parts In-Stock

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$19.190

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,413 parts In-Stock

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SupplyDigital Components

Austria . 4,500 parts In-Stock

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Problanco Electronics

Mexico . 4,294 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,183 parts In-Stock

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Corphita

USA . 2,109 parts In-Stock

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Kulean Microsystems

USA . 129 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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UHIMA Technologies

Türkiye . 40 parts In-Stock

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Overview

Unlock the power of efficiency with the NTB4302T4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a maximum drain current of 74A and an operating temperature of 150 °C, this N-channel transistor offers unparalleled performance and reliability. Say goodbye to inefficiency and hello to seamless operation with the NTB4302T4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and increases efficiency in certain applications.

Transistor Application: SWITCHING

Ideal for applications requiring rapid switching of electrical signals.

Surface Mount: YES

Convenient for automated assembly processes and compact circuit designs.

Minimum DS Breakdown Voltage: 30 V

Provides a safety margin for higher voltage operations.

Maximum Pulsed Drain Current (IDM): 175 A

Capable of handling high currents during short pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 722 mJ

Can withstand high energy spikes without damage, ensuring reliability in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 74 A

Capable of handling continuous high currents for sustained periods.

Maximum Power Dissipation (Abs): 80 W

Can dissipate heat effectively to prevent overheating in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides good conductivity and switching speed, essential for efficient operation.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments without performance degradation.

Terminal Finish: TIN

Ensures good electrical conductivity and reliable connections.

Maximum Drain-Source On Resistance: 0.0093 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB4302T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB4302T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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