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NTB4302G

Onsemi

NTB4302G by Onsemi

The Onsemi NTB4302G is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 175A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0093 ohm RDS(on), and 80W Pdiss in a small outline package.

Median Price

$0.343

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

1,700

-

$0.343

$0.285

$0.254

DigiKey

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.290

1,700

-

-

-

$0.290

Verical

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.386

10k+ parts

$0.318

1,700

-

-

$0.386

$0.318

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,273 parts In-Stock

1+ parts

$0.268

100+ parts

-

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1,273

$0.268

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-

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Vyrian

USA . 265 parts In-Stock

1+ parts

$0.282

100+ parts

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265

$0.282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,632 parts In-Stock

1+ parts

$0.254

100+ parts

-

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-

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1,632

$0.254

-

-

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Corohmni

South Africa . 491 parts In-Stock

1+ parts

$0.282

100+ parts

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491

$0.282

-

-

-

Component Stockers USA

USA . 2,007 parts In-Stock

1+ parts

$0.290

100+ parts

$0.270

1k+ parts

$0.250

10k+ parts

-

2,007

$0.290

$0.270

$0.250

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

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20,000

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TANS Electronics

Latvia . 5,366 parts In-Stock

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5,366

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SupplyDigital Components

Austria . 2,018 parts In-Stock

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2,018

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Continental Prestige Electronics

USA . 1,700 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.258

10k+ parts

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1,700

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-

$0.258

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Problanco Electronics

Mexico . 1,076 parts In-Stock

1+ parts

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1,076

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Kulean Microsystems

USA . 797 parts In-Stock

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797

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UHIMA Technologies

Türkiye . 386 parts In-Stock

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386

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Overview

Unleash the power of innovation with the NTB4302G by Onsemi! Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor boasts a single configuration with a built-in diode, providing seamless performance. From its enhanced mode operation to its high pulsing capability, this transistor is designed to exceed expectations. Whether you're in need of efficient power management or reliable circuit protection, the NTB4302G delivers exceptional value and benefits. Trust Onsemi to elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher switching speeds compared to P-channel FETs, making them ideal for efficient power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect against reverse polarity and voltage spikes, adding a layer of reliability to the FET's performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficient power handling capabilities.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on printed circuit boards, saving space and simplifying the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low leakage current, making them a versatile choice for various power control applications.

Maximum Pulsed Drain Current (IDM): 175 A

With a high pulsed drain current rating, this FET can handle short bursts of power without overheating or damage, suitable for high-performance applications.

Avalanche Energy Rating (EAS): 722 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, improving the overall reliability of the system.

Maximum Power Dissipation (Abs): 80 W

The high power dissipation capability allows the FET to handle high power loads without overheating, ensuring reliable performance in demanding conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate effectively in high-temperature environments, providing stability and performance under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTB4302G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB4302G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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