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NSVMUN5333DW1T3G

Onsemi

NSVMUN5333DW1T3G by Onsemi

NSVMUN5333DW1T3G by Onsemi is a Small Signal BJT with NPN and PNP types. It features separate elements with built-in resistor, VCEsat of 0.25V, and hFE min of 80. Ideal for automotive applications due to AEC-Q101 standard compliance and max operating temperature of 150 °C.

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Lifecycle Status

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1k+

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AZTECH Wire

Italy . 641 parts In-Stock

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Kulean Microsystems

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Overview

Discover the ultimate solution for your small signal bipolar junction transistor needs with the NSVMUN5333DW1T3G by Onsemi. With a high-quality construction and reliable performance, this product offers unparalleled advantages in various applications. Whether you're in the automotive industry or electronics manufacturing, this NPN and PNP transistor configuration with built-in resistor elements is sure to exceed your expectations. Experience the value of seamless integration with its surface mount capability and maximum VCEsat of 0.25V. Trust Onsemi's reputation for excellence and unlock the benefits of this innovative product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the transistor suitable for a wide range of applications.

Polarity or Channel Type: NPN AND PNP

Having both NPN and PNP types allows flexibility in circuit design, enabling the transistor to be used in various configurations.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and reduces the need for additional components, making the transistor easy to use.

Maximum VCEsat: 0.25 V

Low VCEsat ensures efficient operation and minimal power loss, making the transistor energy-efficient.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB assembly, saving time and effort during manufacturing.

Maximum Power Dissipation (Abs): 0.385 W

With high power dissipation capability, the transistor can handle moderate power levels without overheating or damage.

Minimum DC Current Gain (hFE): 80

High DC current gain ensures amplification of the input signal, making the transistor suitable for signal amplification applications.

Maximum Collector-Emitter Voltage: 50 V

The high collector-emitter voltage rating allows the transistor to withstand higher voltage levels, increasing its versatility.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables the transistor to function reliably in harsh environmental conditions.

Maximum Collector Current (IC): 0.1 A

The high collector current rating allows the transistor to handle moderate current levels, making it suitable for various applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSVMUN5333DW1T3G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 10

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Maximum VCEsat:

.25 V

Trade Compliance

NSVMUN5333DW1T3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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