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NLX3G16BMX1TCG

Onsemi

NLX3G16BMX1TCG by Onsemi

NLX3G16BMX1TCG by Onsemi is a logic gate with 3 functions, 12ns propagation delay at 3.3V. Ideal for military applications due to its CMOS technology and wide operating temperature range of -55 °C to 125°C. Suitable for surface mount with small outline package style.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 132,000 parts In-Stock

1+ parts

-

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$0.132

1k+ parts

$0.110

10k+ parts

$0.098

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$0.132

$0.110

$0.098

Verical

USA . 93,000 parts In-Stock

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$0.122

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$0.122

Distributors (In-Stock)

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Digiode

USA . 1,441 parts In-Stock

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$0.103

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1,441

$0.103

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Vyrian

USA . 317 parts In-Stock

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$0.108

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317

$0.108

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Distributors (Availability)

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Corphita

USA . 1,846 parts In-Stock

1+ parts

$0.097

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$0.097

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Vigor

Singapore . 552 parts In-Stock

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$0.100

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552

$0.100

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Corohmni

South Africa . 98 parts In-Stock

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$0.108

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98

$0.108

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Component Stockers USA

USA . 142,660 parts In-Stock

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$0.110

100+ parts

$0.100

1k+ parts

$0.090

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$0.090

142,660

$0.110

$0.100

$0.090

$0.090

Continental Prestige Electronics

USA . 132,000 parts In-Stock

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$0.094

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$0.094

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TANS Electronics

Latvia . 8,162 parts In-Stock

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SupplyDigital Components

Austria . 6,823 parts In-Stock

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Problanco Electronics

Mexico . 3,752 parts In-Stock

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Kulean Microsystems

USA . 2,171 parts In-Stock

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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Microchip USA

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Overview

Enhance your electronics projects with the NLX3G16BMX1TCG Logic Gates by Onsemi. With a compact design and fast propagation delay of just 12ns, this high-quality product offers reliability and efficiency. Ideal for a wide range of applications, this logic gate ensures optimal performance in various circuits. Trust Onsemi's expertise and innovation to deliver top-notch components that meet your needs. Upgrade your projects today and experience the value and benefits that the NLX3G16BMX1TCG Logic Gates provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast operation and high-speed performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on circuit boards.

No. of Functions: 3

Multiple functions in a single component provide flexibility and space-saving benefits in circuit design.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and facilitates easier integration into circuit layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages, ensuring easy integration into existing systems.

Load Capacitance (CL): 15 pF

Suitable load capacitance for efficient data transmission and signal processing.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages allows for versatile applications in different systems.

No. of Terminals: 8

Sufficient terminals for connecting to other components and circuitry.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on circuit boards.

Maximum I (ol): 4 Amp

High output current capability for driving loads and ensuring reliability.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliable performance in various environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range for reliable performance in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for superior conductivity and durability.

Terminal Position: DUAL

Dual terminal position for versatile mounting options and compatibility.

Maximum Seated Height: 0.4 mm

Low seated height for compact and low-profile circuit designs.

Width: 1 mm

Narrow width for space-efficient layout and integration.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage for energy-efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during assembly processes.

Length: 1.6 mm

Compact length for space-saving circuit board design.

Temperature Grade: MILITARY

Military-grade temperature range and reliability for demanding applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Packing Method: TR

Tray packing method for easy handling and protection during shipping and storage.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density mounting and connection with other components.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage for compatibility with various systems and applications.

Technical Specifications

Logic Gates NLX3G16BMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX3G16BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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