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NLX3G14AMX1TCG

Onsemi

NLX3G14AMX1TCG by Onsemi

NLX3G14AMX1TCG by Onsemi is a CMOS Logic Gate with 9.1ns Propagation Delay, Schmitt Trigger, and 15pF Load Capacitance. Ideal for military applications due to its MILITARY Temperature Grade and small outline package style.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53,444 parts In-Stock

1+ parts

-

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$0.132

1k+ parts

$0.110

10k+ parts

$0.098

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$0.132

$0.110

$0.098

DigiKey

USA . 53,444 parts In-Stock

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$0.170

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$0.170

Verical

USA . 41,444 parts In-Stock

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$0.122

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$0.122

Distributors (In-Stock)

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Digiode

USA . 2,017 parts In-Stock

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$0.103

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2,017

$0.103

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Chip Stock

USA . 60,000 parts In-Stock

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J2 Sourcing AB

Sweden . 30,000 parts In-Stock

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Vyrian

USA . 10,007 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,429 parts In-Stock

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$0.097

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$0.097

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Vigor

Singapore . 150 parts In-Stock

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$0.100

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$0.100

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Corohmni

South Africa . 240 parts In-Stock

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$0.108

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$0.108

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Component Stockers USA

USA . 40,047 parts In-Stock

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$0.110

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$0.100

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$0.090

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$0.090

40,047

$0.110

$0.100

$0.090

$0.090

AZTECH Wire

Italy . 1,042 parts In-Stock

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$10.650

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$10.650

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Continental Prestige Electronics

USA . 53,444 parts In-Stock

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$0.094

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QUARKTWIN TECHNOLOGY LTD

USA . 7,151 parts In-Stock

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TANS Electronics

Latvia . 7,048 parts In-Stock

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Microchip USA

USA . 6,783 parts In-Stock

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Problanco Electronics

Mexico . 3,904 parts In-Stock

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Kulean Microsystems

USA . 1,916 parts In-Stock

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SupplyDigital Components

Austria . 1,131 parts In-Stock

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UHIMA Technologies

Türkiye . 952 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NLX3G14AMX1TCG logic gates by Onsemi. Designed for military-grade applications, this product offers a fast propagation delay of 9.1 ns, ensuring quick response times. With a wide operating temperature range and superior build quality, Onsemi guarantees top-notch functionality and durability. Whether you're working on aerospace, defense, or industrial projects, trust the NLX3G14AMX1TCG to deliver exceptional results every time. Elevate your designs with this advanced logic gate solution from the industry leader, Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 9.1 ns

Low propagation delay ensures fast signal processing and reduces overall system latency.

Package Style: SMALL OUTLINE

Compact package style saves space on the PCB, allowing for a more efficient layout design.

Nominal Supply Voltage: 2.5V

Ideal supply voltage that balances power consumption and performance for the logic gates.

Temperature Grade: MILITARY

High-temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates NLX3G14AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

9.1 ns

Propagation Delay (tpd):

9.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX3G14AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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