Loading...

NLX3G14DMUTCG

Onsemi

NLX3G14DMUTCG by Onsemi

NLX3G14DMUTCG by Onsemi is a CMOS Logic Gate with 3 functions, 9.1 ns propagation delay, and 15 pF load capacitance. Ideal for military applications due to its small outline package style and Schmitt Trigger technology. Operating temperature range from -55 to 125 °C with a supply voltage of 1.65-5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,408

-

-

-

-

Digiode

USA . 459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

459

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,168

-

-

-

-

TANS Electronics

Latvia . 6,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,237

-

-

-

-

Problanco Electronics

Mexico . 5,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,849

-

-

-

-

Kulean Microsystems

USA . 4,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,026

-

-

-

-

Corphita

USA . 591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

591

-

-

-

-

UHIMA Technologies

Türkiye . 547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

547

-

-

-

-

Corohmni

South Africa . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

215

-

-

-

-

Overview

Unleash the power of precision with the NLX3G14DMUTCG by Onsemi. Crafted with quality materials and cutting-edge technology, this logic gate offers unmatched reliability and performance. Ideal for a wide range of applications, this product promises fast propagation delay and low power consumption. Experience seamless integration and exceptional efficiency with Onsemi's NLX3G14DMUTCG. Elevate your projects to new heights with this top-tier solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 9.1 ns

The low propagation delay at nominal supply ensures fast operation, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 3

Having multiple functions in one component saves space on the PCB and simplifies the circuit design.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V is common in many electronic devices, making this product compatible with a wide range of applications.

Load Capacitance (CL): 15 pF

The low load capacitance ensures minimal power consumption and efficient operation of the logic gates.

Power Supplies (V): 1.8/5

The ability to support multiple power supplies (1.8V and 5V) offers flexibility in system integration and compatibility with different voltage requirements.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of the package design help in saving space on the PCB and allow for compact and sleek electronic device designs.

Maximum I (ol): 8 Amp

The high output current capability of 8A allows the logic gates to drive multiple loads or devices without the need for external drivers.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance in harsh environmental conditions and industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the product to operate effectively in extreme cold environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and allows for easy connection to external components.

Maximum Seated Height: 0.55 mm

The low maximum seated height of 0.55mm enables compact and space-efficient PCB designs.

Width: 1 mm

The small width of 1mm helps in reducing the overall size of the product and facilitates dense packing of components on the PCB.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V allows the product to operate efficiently in low power applications.

Length: 1.95 mm

The compact length of 1.95mm contributes to the overall small form factor of the product, making it suitable for space-constrained designs.

Temperature Grade: MILITARY

The military-grade temperature grade ensures high reliability, ruggedness, and performance in demanding military and aerospace applications.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger feature helps in minimizing noise and signal distortion, ensuring reliable and stable operation of the logic gates.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and eliminates the risk of lead contamination, making the product environmentally friendly.

Packing Method: TR

The TR packing method provides efficient handling, storage, and transportation of the product, ensuring its integrity and quality during distribution.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on the PCB, saving space and enabling compact electronic device designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V offers compatibility with a wide range of power sources and allows for robust and reliable operation of the logic gates.

Technical Specifications

Logic Gates NLX3G14DMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

3G

JESD-30 Code:

R-PDSO-N8

Length:

1.95 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

9.1 ns

Propagation Delay (tpd):

9.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX3G14DMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17