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NLX2G14CMX1TCG

Onsemi

NLX2G14CMX1TCG by Onsemi

NLX2G14CMX1TCG by Onsemi is a CMOS Logic Gate with 9.1ns Propagation Delay, suitable for military applications. It operates at a voltage range of 1.65V to 5.5V and has Schmitt Trigger functionality, making it ideal for high-speed signal processing in harsh environments. The package style is small outline with very thin profile, featuring surface mount technology for compact designs.

Median Price

$0.146

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2,240 parts In-Stock

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$0.160

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2,240

$0.160

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Chip1Stop

Japan . 1,620 parts In-Stock

1+ parts

$1.110

100+ parts

$0.406

1k+ parts

$0.349

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1,620

$1.110

$0.406

$0.349

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Rochester

USA . 135,591 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

135,591

-

$0.132

$0.110

$0.098

Verical

USA . 107,684 parts In-Stock

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$0.122

107,684

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$0.122

Distributors (In-Stock)

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Digiode

USA . 393 parts In-Stock

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$0.103

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393

$0.103

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Vyrian

USA . 6,390 parts In-Stock

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6,390

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ComSIT Distribution GmbH

Germany . 806 parts In-Stock

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Corphita

USA . 697 parts In-Stock

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$0.097

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697

$0.097

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Vigor

Singapore . 233 parts In-Stock

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$0.100

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233

$0.100

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Corohmni

South Africa . 254 parts In-Stock

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$0.108

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254

$0.108

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AZTECH Wire

Italy . 112 parts In-Stock

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$18.270

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Continental Prestige Electronics

USA . 146,735 parts In-Stock

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$0.094

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Perfect Parts

USA . 14,635 parts In-Stock

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Assy Fe

Spain . 11,177 parts In-Stock

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Kepictronics

USA . 10,872 parts In-Stock

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SupplyDigital Components

Austria . 5,366 parts In-Stock

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Kulean Microsystems

USA . 4,502 parts In-Stock

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Problanco Electronics

Mexico . 4,092 parts In-Stock

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TANS Electronics

Latvia . 3,698 parts In-Stock

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Authorized Procurement Solutions

USA . 1,620 parts In-Stock

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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Microchip USA

USA . 468 parts In-Stock

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Overview

Elevate your electronics projects with the NLX2G14CMX1TCG by Onsemi, a top-quality logic gates component that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this product is designed for precision and efficiency, perfect for a wide range of applications in the tech world. With fast propagation delay, low power consumption, and durable construction, the NLX2G14CMX1TCG provides exceptional value and flexibility to customers. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 9.1 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing costs.

No. of Functions: 2

Having multiple functions in a single package increases functionality and versatility.

Nominal Supply Voltage / Vsup (V): 2.3

Operating at a low supply voltage helps reduce power consumption and heat dissipation.

Load Capacitance (CL): 15 pF

Low load capacitance ensures minimal signal distortion and helps maintain signal integrity.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages offers flexibility in different operating conditions.

Maximum Operating Temperature: 125 °C

High temperature tolerance allows this product to be used in a wide range of environments.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product can withstand extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Schmitt Trigger: YES

Having a Schmitt trigger input helps clean up noisy signals and improve signal integrity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Technical Specifications

Logic Gates NLX2G14CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

9.1 ns

Propagation Delay (tpd):

9.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G14CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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