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NLVHCT14ADR2G

Onsemi

NLVHCT14ADR2G by Onsemi

NLVHCT14ADR2G by Onsemi is a CMOS Logic Gates IC with 6 functions, 48ns propagation delay, and operates b/w -55 to 125 °C. It is AEC-Q100 qualified for automotive applications, featuring a small outline package with dual terminals suitable for surface mount assembly.

Median Price

$0.145

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,857 parts In-Stock

1+ parts

-

100+ parts

$0.167

1k+ parts

$0.138

10k+ parts

$0.123

45,857

-

$0.167

$0.138

$0.123

DigiKey

USA . 45,857 parts In-Stock

1+ parts

-

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$0.140

45,857

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-

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$0.140

Verical

USA . 45,857 parts In-Stock

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$0.145

45,857

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$0.145

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 748 parts In-Stock

1+ parts

$0.130

100+ parts

-

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748

$0.130

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Vyrian

USA . 614 parts In-Stock

1+ parts

$0.137

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614

$0.137

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Distributors (Availability)

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Ampacity Inc.

Singapore . 45,851 parts In-Stock

1+ parts

$0.116

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45,851

$0.116

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Corphita

USA . 360 parts In-Stock

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$0.123

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360

$0.123

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

$0.137

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496

$0.137

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Vigor

Singapore . 234 parts In-Stock

1+ parts

$0.210

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234

$0.210

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Microchip USA

USA . 6,378 parts In-Stock

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6,378

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Problanco Electronics

Mexico . 6,153 parts In-Stock

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TANS Electronics

Latvia . 3,472 parts In-Stock

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SupplyDigital Components

Austria . 3,276 parts In-Stock

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Kulean Microsystems

USA . 1,090 parts In-Stock

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UHIMA Technologies

Türkiye . 120 parts In-Stock

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Overview

Boost your electronic projects with the NLVHCT14ADR2G by Onsemi! Crafted with precision and quality, this logic gates component offers unmatched reliability and performance. Ideal for a wide range of applications, this product is sure to meet all your needs with its innovative design and advanced technology. Trust in Onsemi's reputation for excellence and get your hands on this versatile and efficient component today. Elevate your projects to the next level with the NLVHCT14ADR2G - where quality meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates.

No. of Functions: 6

Having multiple functions in a single device can help save space and simplify circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level of 5V makes it compatible with many existing systems and components.

Propagation Delay (tpd): 48 ns

Low propagation delay ensures fast processing and response times in logic operations.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable.

Technical Specifications

Logic Gates NLVHCT14ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

48 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLVHCT14ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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