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NLVHC32ADTR2G

Onsemi

NLVHC32ADTR2G by Onsemi

NLVHC32ADTR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 110 ns propagation delay. It operates b/w -55 to 125 °C and has AEC-Q100 screening for automotive applications. The small outline package with dual terminals is suitable for high-temperature environments in military-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,349 parts In-Stock

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Digiode

USA . 2,397 parts In-Stock

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Vigor

Singapore . 263 parts In-Stock

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$0.230

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Microchip USA

USA . 3,824 parts In-Stock

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$1.185

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AZTECH Wire

Italy . 627 parts In-Stock

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$13.060

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Problanco Electronics

Mexico . 8,305 parts In-Stock

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TANS Electronics

Latvia . 4,958 parts In-Stock

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Kulean Microsystems

USA . 3,120 parts In-Stock

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SupplyDigital Components

Austria . 2,843 parts In-Stock

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Corphita

USA . 1,864 parts In-Stock

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UHIMA Technologies

Türkiye . 562 parts In-Stock

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Corohmni

South Africa . 302 parts In-Stock

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Overview

Experience seamless logic gate functionality with the NLVHC32ADTR2G by Onsemi. Crafted with precision and reliability in mind, this high-quality component offers unmatched performance for a wide range of applications. From automotive to industrial settings, this logic gate provides a versatile solution that delivers value and efficiency to customers. Trust in Onsemi's reputation for excellence and elevate your projects with the NLVHC32ADTR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the logic gates.

Surface Mount: YES

Being surface mountable makes it easy to integrate these logic gates onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 4

Having 4 functions in one package means greater functionality and efficiency in circuit design.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making these logic gates suitable for automotive and industrial applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly used in many electronic systems, providing compatibility and ease of integration.

Propagation Delay (tpd): 110 ns

With a low propagation delay of 110 ns, these logic gates offer fast response times for signal processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable operation even in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates NLVHC32ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

110 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLVHC32ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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