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NLV74VHCT244ADTRG

Onsemi

NLV74VHCT244ADTRG by Onsemi

NLV74VHCT244ADTRG by Onsemi is a 20-terminal bus driver with 8.4ns propagation delay, operating at -40 to 125 °C. Ideal for automotive applications, it features CMOS technology, 3-STATE output characteristics, and AEC-Q100 screening level.

Median Price

$0.354

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,777 parts In-Stock

1+ parts

$0.354

100+ parts

$0.333

1k+ parts

$0.301

10k+ parts

-

3,777

$0.354

$0.333

$0.301

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 816 parts In-Stock

1+ parts

$0.336

100+ parts

-

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816

$0.336

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Vyrian

USA . 6,523 parts In-Stock

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6,523

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Distributors (Availability)

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Corphita

USA . 1,764 parts In-Stock

1+ parts

$0.319

100+ parts

-

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1,764

$0.319

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Corohmni

South Africa . 128 parts In-Stock

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$0.354

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128

$0.354

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Vigor

Singapore . 174 parts In-Stock

1+ parts

$0.390

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174

$0.390

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$11.200

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500

$11.200

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Component Stockers USA

USA . 766 parts In-Stock

1+ parts

$99.990

100+ parts

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766

$99.990

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Kulean Microsystems

USA . 8,088 parts In-Stock

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8,088

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SupplyDigital Components

Austria . 6,865 parts In-Stock

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6,865

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Problanco Electronics

Mexico . 3,042 parts In-Stock

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3,042

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Kepictronics

USA . 2,160 parts In-Stock

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2,160

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Perfect Parts

USA . 2,139 parts In-Stock

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2,139

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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TANS Electronics

Latvia . 1,528 parts In-Stock

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1,528

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UHIMA Technologies

Türkiye . 643 parts In-Stock

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643

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Microchip USA

USA . 263 parts In-Stock

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263

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Overview

Discover the superior quality and reliability of the NLV74VHCT244ADTRG by Onsemi, a top manufacturer in the industry. This bus driver and transceiver is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its advanced technology and automotive-grade components, this product guarantees optimal performance and efficiency. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and transportation.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

No. of Functions: 2

Provides multiple functions in a single component, saving space and cost.

Screening Level: AEC-Q100

Meets automotive industry quality standards for reliability and performance.

Propagation Delay (tpd): 8.4 ns

Fast signal processing for efficient data transmission.

Minimum Operating Temperature: -40 °C

Suitable for harsh environments and extreme temperature conditions.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Technical Specifications

Bus Driver & Transceivers NLV74VHCT244ADTRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

8.4 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74VHCT244ADTRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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