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NLV74VHC125DG

Onsemi

NLV74VHC125DG by Onsemi

NLV74VHC125DG by Onsemi is a 4-function bus driver with 16ns propagation delay. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2-5.5V, it features 3-STATE output and AEC-Q100 screening level for automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,614 parts In-Stock

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Digiode

USA . 902 parts In-Stock

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902

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Distributors (Availability)

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Component Stockers USA

USA . 13,271 parts In-Stock

1+ parts

$3.470

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$3.470

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AZTECH Wire

Italy . 450 parts In-Stock

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$8.770

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450

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Kulean Microsystems

USA . 7,700 parts In-Stock

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7,700

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TANS Electronics

Latvia . 4,895 parts In-Stock

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4,895

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Problanco Electronics

Mexico . 1,583 parts In-Stock

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SupplyDigital Components

Austria . 911 parts In-Stock

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911

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UHIMA Technologies

Türkiye . 583 parts In-Stock

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583

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Corphita

USA . 474 parts In-Stock

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Corohmni

South Africa . 468 parts In-Stock

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468

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Vigor

Singapore . 320 parts In-Stock

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Microchip USA

USA . 119 parts In-Stock

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Overview

Enhance your electronic designs with the NLV74VHC125DG by Onsemi, a top-tier manufacturer known for quality and reliability. This Bus Driver & Transceiver offers unparalleled performance and versatility, making it perfect for a wide range of applications. With its advanced features and cutting-edge technology, this product provides customers with exceptional value, efficiency, and precision. Elevate your projects with the NLV74VHC125DG and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in buses where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the bus driver & transceiver, saving time and effort during assembly.

No. of Functions: 4

With 4 functions in one device, it offers increased functionality and integration, reducing the need for multiple components and simplifying the design of the bus system.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard bus systems and power sources, making it a versatile choice for a wide range of applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in extreme temperature conditions, making it suitable for use in rugged environments such as military vehicles or outdoor buses.

Technical Specifications

Bus Driver & Transceivers NLV74VHC125DG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

16 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74VHC125DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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