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NLV74LCX244DTR2G

Onsemi

NLV74LCX244DTR2G by Onsemi

NLV74LCX244DTR2G by Onsemi is a 4-bit bus driver with 7.8ns propagation delay and TRUE output polarity. Ideal for military applications, it operates b/w -55 to 125 °C with a supply voltage range of 2-3.6V, featuring AEC-Q100 screening level for automotive use.

Median Price

$0.391

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,592 parts In-Stock

1+ parts

-

100+ parts

$0.384

1k+ parts

$0.318

10k+ parts

$0.284

2,592

-

$0.384

$0.318

$0.284

Verical

USA . 1,558 parts In-Stock

1+ parts

-

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$0.398

10k+ parts

$0.355

1,558

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-

$0.398

$0.355

Distributors (In-Stock)

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Digiode

USA . 2,143 parts In-Stock

1+ parts

$0.299

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2,143

$0.299

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Vyrian

USA . 5,994 parts In-Stock

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5,994

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Rebound Electronics

UK . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 1,138 parts In-Stock

1+ parts

$0.284

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1,138

$0.284

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Vigor

Singapore . 570 parts In-Stock

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$0.310

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570

$0.310

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Corohmni

South Africa . 376 parts In-Stock

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$0.315

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376

$0.315

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AZTECH Wire

Italy . 1,103 parts In-Stock

1+ parts

$15.740

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1,103

$15.740

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QUARKTWIN TECHNOLOGY LTD

USA . 27,314 parts In-Stock

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SupplyDigital Components

Austria . 8,297 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Microchip USA

USA . 4,739 parts In-Stock

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TANS Electronics

Latvia . 3,956 parts In-Stock

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Problanco Electronics

Mexico . 3,642 parts In-Stock

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Kulean Microsystems

USA . 1,954 parts In-Stock

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UHIMA Technologies

Türkiye . 356 parts In-Stock

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356

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Overview

Enhance your electronic designs with the NLV74LCX244DTR2G by Onsemi, a top-tier manufacturer known for high-quality components. This bus driver & transceiver offers exceptional performance in a compact package, making it ideal for a wide range of applications. With its advanced technology and reliable output characteristics, this product delivers outstanding value and benefits to customers seeking efficient and dependable solutions for their projects. Trust Onsemi to provide you with the tools you need to bring your creations to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for harsh environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

No. of Functions: 2

Having 2 functions in one device increases the functionality and versatility of the product, making it a cost-effective solution.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 7.8 ns

Low propagation delay of 7.8ns allows for fast and efficient data transmission, ideal for high-speed applications.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and performance in extreme temperature conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers NLV74LCX244DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

7.8 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74LCX244DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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