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NLV27WZ06DFT2G

Onsemi

NLV27WZ06DFT2G by Onsemi

NLV27WZ06DFT2G by Onsemi is a Logic Gate with 2 functions, AEC-Q100 screening, and 5V nominal voltage. Ideal for military applications, it operates b/w -55 to 125 °C with a propagation delay of 11ns. The package style is small outline, thin profile, shrink pitch.

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12,078 parts In-Stock

1+ parts

$0.380

100+ parts

$0.125

1k+ parts

$0.081

10k+ parts

$0.059

12,078

$0.380

$0.125

$0.081

$0.059

Rochester

USA . 17,450 parts In-Stock

1+ parts

-

100+ parts

$0.058

1k+ parts

$0.048

10k+ parts

$0.043

17,450

-

$0.058

$0.048

$0.043

Verical

USA . 17,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.072

17,450

-

-

-

$0.072

Distributors (In-Stock)

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Digiode

USA . 839 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

10k+ parts

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839

$0.046

-

-

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Vyrian

USA . 977 parts In-Stock

1+ parts

$0.048

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977

$0.048

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Flip Electronics

USA . 250,000 parts In-Stock

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250,000

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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Inventory MP

USA . 5,701 parts In-Stock

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5,701

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Bristol Electronics

USA . 5,701 parts In-Stock

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5,701

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Distributors (Availability)

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Corphita

USA . 432 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

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432

$0.043

-

-

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Corohmni

South Africa . 404 parts In-Stock

1+ parts

$0.048

100+ parts

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404

$0.048

-

-

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Vigor

Singapore . 457 parts In-Stock

1+ parts

$0.220

100+ parts

-

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10k+ parts

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457

$0.220

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.683

100+ parts

$19.732

1k+ parts

$17.780

10k+ parts

-

3,000

$21.683

$19.732

$17.780

-

Perfect Parts

USA . 70,560 parts In-Stock

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70,560

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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6,196

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TANS Electronics

Latvia . 3,602 parts In-Stock

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3,602

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Kulean Microsystems

USA . 1,846 parts In-Stock

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1,846

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SupplyDigital Components

Austria . 648 parts In-Stock

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648

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UHIMA Technologies

Türkiye . 40 parts In-Stock

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40

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Overview

Discover the powerful performance and reliability of the NLV27WZ06DFT2G by Onsemi. With a focus on quality and innovation, Onsemi delivers cutting-edge Logic Gates that are ideal for a wide range of applications. From automotive electronics to industrial control systems, this product offers unmatched value and benefits to customers. Trust in Onsemi's expertise and experience to provide you with the high-quality components you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package body durable and lightweight, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy and compact integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Having 2 functions in one component increases functionality and efficiency in circuit designs.

Propagation Delay (tpd): 11 ns

With a low propagation delay of 11 ns, this product offers fast signal processing, making it suitable for high-speed applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for flexibility in connecting multiple devices and integrating with different logic levels.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can withstand harsh environmental conditions and operate reliably in extreme temperatures.

Technical Specifications

Logic Gates NLV27WZ06DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV27WZ06DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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